Solidigm
Datapath Engineer
Solidigm, Rancho Cordova, California, us, 95741
Join a multibillion-dollar global company that brings together amazing technology, people, and operational scale to become a powerhouse in the memory industry. Headquartered in Rancho Cordova, California, Solidigm combines elements of an established, successful technology company with the spirit, agility, and entrepreneurial mindset of a start-up. In addition to the U.S. headquarters and other facilities in the U.S., the company has an international presence in Asia, Europe, and the Americas. Solidigm will continue to lead the world in innovating new Memory technologies with aspirations to be the #1 NAND memory company in the world. At Solidigm, we view problems as opportunities to define innovative solutions that hold the power to change the world and unleash the potential technological needs that the future holds. At Solidigm, we are One Team that fosters a diverse, equitable, and inclusive culture that embraces individual uniqueness and empowers us to bring our best selves to deliver excellence in support of Solidigm's vision and mission to be the go-to partner for optimized data storage solutions. You can be part of the takeoff of an innovative business that develops cutting-edge products, delivers strong business value for customers, provides an engaging workplace for its employees, and serves a greater impact on the world. This is a golden opportunity for the right applicant to join us and help design, build, and lead Solidigm. We want a diverse team of dedicated professionals who will not just be Solidigm team members but contribute to how we shape the future of the organization. We are seeking applicants who will grow and thrive in our culture; be customer inspired, trusting, innovative, team-oriented, inclusive, results driven, collaborative, passionate, and flexible.Job Description
As a datapath engineer, you will play a central role in ensuring the performance of 3D NAND designs. Your expertise will be crucial in designing and verifying NAND designs that meet stringent power and performance specifications and driving the development of world-class verification strategies to guarantee reliable products.Key Responsibilities
Lead design and development of datapath and I/O circuits for 3D NAND designs to achieve higher IO speeds and optimal performance.Architect and design robust HSIO solutions and ensure they meet stringent key performance indicators in terms of power, performance, and area within process limitations.Oversee front and backend HSIO testing in the post-Si phase compliant with industry standard best practices.Collaborate with cross-functional teams to address and resolve product and HVM related challenges ensuring seamless integration and functionality at the SSD level.Qualifications
A Master's degree in Electrical or Computer Engineering with at least 5 years of relevant NAND experience, or a Bachelor's degree in Electrical or Computer Engineering with 7+ years of relevant experience.Proven expertise in RX, TX, and I/O pipeline circuit design and debug.Hands-on experience with DDR I/O interface training and calibration techniques.Deep understanding of high-speed I/O circuit layout and intricacies of their designs.Knowledge of high-speed I/O mechanisms and associated reliability concerns.Experience in power and signal integrity challenges of HSIO circuits.Exceptional communication skills with the ability to articulate complex technical concepts to peers and cross-functional teams.Additional Information
For California, Colorado, New York, Washington, and remote roles: The compensation range for this role is $127,260 - $203,620. Actual compensation is influenced by a variety of factors including but not limited to skills, experience, qualifications, and geographic location.
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As a datapath engineer, you will play a central role in ensuring the performance of 3D NAND designs. Your expertise will be crucial in designing and verifying NAND designs that meet stringent power and performance specifications and driving the development of world-class verification strategies to guarantee reliable products.Key Responsibilities
Lead design and development of datapath and I/O circuits for 3D NAND designs to achieve higher IO speeds and optimal performance.Architect and design robust HSIO solutions and ensure they meet stringent key performance indicators in terms of power, performance, and area within process limitations.Oversee front and backend HSIO testing in the post-Si phase compliant with industry standard best practices.Collaborate with cross-functional teams to address and resolve product and HVM related challenges ensuring seamless integration and functionality at the SSD level.Qualifications
A Master's degree in Electrical or Computer Engineering with at least 5 years of relevant NAND experience, or a Bachelor's degree in Electrical or Computer Engineering with 7+ years of relevant experience.Proven expertise in RX, TX, and I/O pipeline circuit design and debug.Hands-on experience with DDR I/O interface training and calibration techniques.Deep understanding of high-speed I/O circuit layout and intricacies of their designs.Knowledge of high-speed I/O mechanisms and associated reliability concerns.Experience in power and signal integrity challenges of HSIO circuits.Exceptional communication skills with the ability to articulate complex technical concepts to peers and cross-functional teams.Additional Information
For California, Colorado, New York, Washington, and remote roles: The compensation range for this role is $127,260 - $203,620. Actual compensation is influenced by a variety of factors including but not limited to skills, experience, qualifications, and geographic location.
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