Electronics Packaging Engineer

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Salary: $95,000 - $200,000 per year

We have unceasingly continued to design and manufacture fluid control components, motion control components, and systems for some of the most demanding applications our customers have.

Do you want to work with some of the nation’s best Clients AND enjoy time at home w/ family? We do too!

• Meaningful Work!
• Best in Class Firm!
• Competitive Compensation Package!
• Complete Benefits Package!
• Flexible Work Schedules!
• Accelerated Career Growth!
• Fun Company Activities!
• Many More!

Job Details:

We are seeking a dynamic and innovative Electronics Packaging Engineer to join our team. The successful candidate will play a crucial role in the design, development, and testing of advanced electronic packaging solutions for our cutting-edge products. This is a permanent position, offering a unique opportunity to work on exciting projects within the aerospace and defense sectors.

Responsibilities:

• Design and develop advanced electronic packaging solutions for high-frequency RF devices, electro-mechanical systems, and other complex electronic assemblies.
• Utilize CAD, CAM, CAE, and PDM tools for design and analysis.
• Perform stress and thermal analysis using ANSYS FEA software.
• Participate in the entire product development process, from concept to production, ensuring that designs meet all technical requirements and quality standards.
• Collaborate with cross-functional teams, including mechanical, electrical, and manufacturing engineers, to optimize designs for manufacturability and reliability.
• Conduct design reviews and provide technical guidance to junior engineers.
• Perform root cause analysis and implement corrective actions for design issues identified during testing or in the field.
• Stay current with the latest technologies and trends in electronic packaging and apply this knowledge to improve our products and processes.

Qualifications:

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, or a related field.
• A minimum of 5 years of experience in electronics packaging design and development, preferably in the aerospace and defense industry.
• Strong knowledge of RF design principles and electro-mechanical design techniques.
• Proficiency in CAD, CAM, CAE, and PDM software.
• Experience with ANSYS FEA software for stress and thermal analysis.
• Familiarity with geometric dimensioning and tolerancing (GD&T) principles.
• Excellent problem-solving skills and the ability to think critically and creatively.
• Strong communication and teamwork skills, with the ability to collaborate effectively with diverse teams.
• Commitment to continuous learning and improvement.
• Must be a self-starter, able to work independently and manage multiple tasks simultaneously.
• A strong desire to create high-quality, innovative, and functional designs that meet the needs of our customers.

Interested in hearing more? Easy Apply now by clicking the "Apply Now" button.