Northrop Grumman Corp. (AU)
Principal or Sr. Principal RF Modeling and Sim Engineer
Northrop Grumman Corp. (AU), California, Missouri, United States, 65018
Requisition ID: R10173594
Category:
Engineering
Location:
McClellan, California, United States of America
Clearance Type:
SCI
Telecommute:
No- Teleworking not available for this position
Shift:
1st Shift (United States of America)
Travel Required:
Yes, 10% of the Time
Relocation Assistance:
Relocation assistance may be available
Positions Available:
3
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work.
We are seeking experienced RF Modeling and Simulation Engineers to join our Sacramento, California design center. You will apply your skills as an RF engineer to advance superconducting processor solutions in support of Northrop Grumman's advanced microelectronics applications business.
This position requires work on site at Northrop Grumman’s McClellan, CA facility.
What You’ll get to Do:
Design, model, and verify RF, microwave, and mixed signal subsystem assemblies
Support verification and validation efforts for RF, analog, and digital hardware designs
Collaborate with peer functions in Mechanical, Manufacturing, Test, and IC design engineering
Derive and trade requirements with subsystem engineers and component level designers
Work directly with component level design peers developing custom RF integrated circuit designs to meet assembly-level requirements
This position may be filled as a Principal RF Modeling and Simulation Engineer OR Sr. Principal RF Modeling and Simulation Engineer level based on the qualifications below.
Basic Qualifications for Principal RF Modeling and Simulation Engineer
Bachelor of Science STEM (Science, Technology, Engineering, Mathematics) degree with 5 years of experience as RF Analog, Digital or Mixed Signal design engineer or 3 years of experience with a master's degree.
Working knowledge of an EM simulation tool (HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity).
Experience working with software programing languages (e.g. skill, python).
Prior experience working with electronics, mechanical requirements, and schematic drawings.
Ability to obtain and maintain a Top Secret/Sensitive Compartmented Information (TS/SCI) security clearance (US Citizenship is a requirement for this).
Basic Qualifications for Sr. Principal RF Modeling and Simulation Engineer
Bachelor of Science STEM (Science, Technology, Engineering, Mathematics) degree with 8 years of experience as RF Analog, Digital or Mixed Signal design engineer, or 3 years of experience with a master's degree.
Working knowledge of an EM simulation tool (HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity).
Experience working with software programing languages (e.g. skill, python).
Prior experience working with electronics, mechanical requirements, and schematic drawings.
Ability to obtain and maintain a Top Secret/Sensitive Compartmented Information (TS/SCI) security clearance (US Citizenship is a requirement for this).
Preferred Qualifications
Well versed in working with Ansys HFSS modeling for RF packaging effects.
Experience with spectrum and network analyzer techniques for EMC measurements.
Hands on experience utilizing test instrumentation such as power supplies, oscilloscopes, spectrum analyzers, for RF or high-speed digital IO circuits.
Prior experience with packaging technologies (e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, wire bonding, etc.).
Experience with cryogenic test stands, superconductivity and mechanical CTE.
Active TS/SCI security clearance with polygraph.
Salary Range:
$107,300 - $160,900
Salary Range 2:
$133,000 - $199,600
The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.
Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer.
#J-18808-Ljbffr
Category:
Engineering
Location:
McClellan, California, United States of America
Clearance Type:
SCI
Telecommute:
No- Teleworking not available for this position
Shift:
1st Shift (United States of America)
Travel Required:
Yes, 10% of the Time
Relocation Assistance:
Relocation assistance may be available
Positions Available:
3
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work.
We are seeking experienced RF Modeling and Simulation Engineers to join our Sacramento, California design center. You will apply your skills as an RF engineer to advance superconducting processor solutions in support of Northrop Grumman's advanced microelectronics applications business.
This position requires work on site at Northrop Grumman’s McClellan, CA facility.
What You’ll get to Do:
Design, model, and verify RF, microwave, and mixed signal subsystem assemblies
Support verification and validation efforts for RF, analog, and digital hardware designs
Collaborate with peer functions in Mechanical, Manufacturing, Test, and IC design engineering
Derive and trade requirements with subsystem engineers and component level designers
Work directly with component level design peers developing custom RF integrated circuit designs to meet assembly-level requirements
This position may be filled as a Principal RF Modeling and Simulation Engineer OR Sr. Principal RF Modeling and Simulation Engineer level based on the qualifications below.
Basic Qualifications for Principal RF Modeling and Simulation Engineer
Bachelor of Science STEM (Science, Technology, Engineering, Mathematics) degree with 5 years of experience as RF Analog, Digital or Mixed Signal design engineer or 3 years of experience with a master's degree.
Working knowledge of an EM simulation tool (HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity).
Experience working with software programing languages (e.g. skill, python).
Prior experience working with electronics, mechanical requirements, and schematic drawings.
Ability to obtain and maintain a Top Secret/Sensitive Compartmented Information (TS/SCI) security clearance (US Citizenship is a requirement for this).
Basic Qualifications for Sr. Principal RF Modeling and Simulation Engineer
Bachelor of Science STEM (Science, Technology, Engineering, Mathematics) degree with 8 years of experience as RF Analog, Digital or Mixed Signal design engineer, or 3 years of experience with a master's degree.
Working knowledge of an EM simulation tool (HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity).
Experience working with software programing languages (e.g. skill, python).
Prior experience working with electronics, mechanical requirements, and schematic drawings.
Ability to obtain and maintain a Top Secret/Sensitive Compartmented Information (TS/SCI) security clearance (US Citizenship is a requirement for this).
Preferred Qualifications
Well versed in working with Ansys HFSS modeling for RF packaging effects.
Experience with spectrum and network analyzer techniques for EMC measurements.
Hands on experience utilizing test instrumentation such as power supplies, oscilloscopes, spectrum analyzers, for RF or high-speed digital IO circuits.
Prior experience with packaging technologies (e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, wire bonding, etc.).
Experience with cryogenic test stands, superconductivity and mechanical CTE.
Active TS/SCI security clearance with polygraph.
Salary Range:
$107,300 - $160,900
Salary Range 2:
$133,000 - $199,600
The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.
Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer.
#J-18808-Ljbffr