Lead IC Package Design Engineer R&D HW · Bengaluru ·

Join FlexAI:

FlexAI is at the forefront of revolutionizing AI computing by reengineering infrastructure at the system level. Our groundbreaking architecture, combined with sophisticated software intelligence, abstraction, and an orchestration layer, allows developers to leverage a diverse array of compute, resulting in efficient, more reliable computing at a fraction of the cost. We are seeking a skilled and experienced

Lead IC Package Design Engineer .The rapid evolution of machine intelligence has created a need for a new system architecture capable of handling high memory capacity and bandwidth. These are critical bottlenecks in pushing machine intelligence to the next level, where compute demand is expected to increase up to 1000 times current levels.FlexAI has pioneered a groundbreaking solution to tackle these memory challenges. Our innovative compute architecture ensures a well-balanced distribution of memory bandwidth, capacity, and compute density, ensuring maximum utilization of system resources. This architecture is the cornerstone of our datacenter-in-a-box concept, which is enabled by our universal AI compute cloud service. Our hardware solutions are built for seamless deployment with our own AI cloud offerings and other cloud service providers worldwide, setting new standards in performance and efficiency.Position Overview:

We are seeking a highly skilled and motivated

Lead IC Package Design Engineer

to join our dynamic team. In this role, you will lead the design of advanced

2.5D

and

3D packaging technologies , from feasibility studies through to production, ensuring high-quality and reliable package designs. You will collaborate across teams and manage various aspects of the IC package design process, including footprint definition, ballmaps, vendor communication, and delivering top-quality results. This role is essential to the success of our cutting-edge technology, and you'll play a pivotal part in shaping FlexAI's success.What you’ll do:

Lead the design of

FlipChip

packages with both single and multi-die configurations.Manage and establish connectivity using

Expedition Substrate Integrator

or Excel-based automation tools.Conduct package feasibility studies by creating mock-up die and bump signal assignments, optimizing the design for electrical and platform specifications.Develop fabrication files and work with substrate suppliers and

OSATs

to ensure

Design for Manufacturing (DFM)

and

Design for Assembly (DFA)

compliance.Collaborate with cross-functional teams, including SI, PI, Platform, Die, and SOC groups, to ensure timely and accurate inputs into the package design.Calculate impedance, apply inductance compensation techniques, and manage via stack and stackup designs.Generate design collateral for PI, SI, and EMI/EMC teams to perform simulations.Design high-speed interfaces, including

DDR, GDDR, HBM, PCIe, DDI, SERDES , and more.Ensure power delivery is optimized for both lateral and vertical designs.Work on challenging designs including

CPUs, dGPUs, and ASIC packages .Engage with vendors to address technical queries and ensure optimal fabrication and assembly yields.What you’ll need:

Bachelor's degree

in

ECE/EEE

or related field.7 to 10 years of experience in

IC package layout design

and

PCB designs .Expertise with tools such as

Mentor Graphics

or

APD

for IC package design.Proficiency in

DFM

and

DFA

rule-checking using tools like

Valor

and

CAM350 .Strong understanding of

IC package materials , PCB design, and the manufacturing process.Knowledge of

wafer-level packaging, RDL, bumping technologies , and

2D/2.5D/3D packaging integration technologies .Familiarity with design and verification methodologies for

2D, 2.5D, and 3D

designs, including

Design Rule Checks (DRC) .Strong problem-solving skills, with the ability to manage multiple projects simultaneously.Excellent collaboration and communication skills, with a proven track record of meeting deadlines.What we offer:

A competitive salary and benefits package, tailored to recognize your dedication and contributions.The opportunity to collaborate with leading experts in AI and cloud computing, learning from the best and the brightest, fostering continuous growth.An environment that values innovation, collaboration, and mutual respect.Support for personal and professional development, empowering you with the tools and resources to elevate your skills and leave a lasting impact.A pivotal role in the AI revolution, shaping the technologies that power the innovations of tomorrow.About FlexAI:

Founded by

Brijesh Tripathi

and

Dali Kilani , who bring experience from Nvidia, Apple, Tesla, Intel, Lifen, and Zoox, FlexAI is not

just

building a product – we’re

shaping the future of AI.Offices:

Paris - HQSan Francisco (Bay Area) - US officeBangalore - India officeApply NOW!

You’ve seen what this role entails. Now we want to hear from you! Does this opportunity align with your aspirations? If you’re even slightly curious, we encourage you to apply – it could be the start of something extraordinary!At FlexAI, we believe diverse teams are the most innovative teams. We’re committed to creating an inclusive environment where everyone feels valued, and we proudly offer equal opportunities regardless of gender, sexual orientation, origin, disabilities, veteran status, or any other facets of your identity that make you uniquely you.

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