ATR International is hiring: Senior Package Substrate Design Engineer in Milpita

Full-Time

Responsibilities

The Package Engineering function provides support, expertise, and insight to the Silicon device development team through preliminary activities of package selection, packaging routing techniques, and necessary modeling and simulation work. The position involves diverse responsibilities, including evaluation of new packaging technology, package recommendation for custom devices, substrate design support, and device/package qualification.

You will be reporting to the Director of Package Design (USA) and working very closely with Package/Manufacturing team in our parent company’s headquarters in Japan and Marketing and Engineering teams located in our Milpitas office during pre/post sales process.

This position requires experience in the Fabless semiconductor model with a broad knowledge of packaging technology and manufacturing. Successful candidates will have a deep understanding of a variety of IC package technologies. Candidate should possess specific experience in the following areas: high performance build-up substrates, flip chip assembly or 2.5D packaging. Knowledge of Chiplet technology, Optical integrated packages, and experience in extracting/simulating package designs for SI and PI using tools such as HFSS, ADS, POWER SI, and other leading tools.

This position requires a broad knowledge of package technology and design:

- high performance build-up substrates

- flip chip assembly

- 2.5D packaging

- Excellent experience in extracting/simulating package designs for Signal and Power integrities (SI & PI) using tools such as HFSS, POWER SI, and/or ADS tools.

Qualifications

- Bachelor’s degree in Electrical Engineering, or other semiconductor packaging related discipline

- 7+ years of experience in semiconductor packaging design and simulations

- Experience with signal and power integrity (SI/PI) tools for package level extraction/simulation

- Ability to work with Package Layout engineers

Preferred Experience and Skills

· Hands on package design; high-speed Signa integrity and Power integrity and package decoupling caps optimizations, combined package and PCB Signal integrity and Power integrity Characterizations, impedance verification, high frequency s-parameters extraction, Hspice model, package Hspice and RLC model extraction and designs

· Hands on high-speed package and PCB design for: high-speed Serdes 112 Gbps, PCIeX5 and 6, LPDDR4,5, Ethernet 25 GBps, power aware SI/PI analysis, up to 40 GHZ s-parameters extraction and verification

· Packaging+PCB high-speed interconnections timing analyses, eye-diagram and jitter budgeting calculation following the LPDDR JEDEC spec, or other highs-speed frequency domain s-parameters extraction following the base Spec of high-speed interconnect

· Hands on PCB design; SI, PI analyses, decoupling caps optimizations, SI and PI Characterization and extractions, impedance verification, s-parameters verifications with lab measurements, Hspice model, PCB RLC model extraction and designs

· Packaging routing analyst, trace impedance analyses and package layout bump to ball analyses

· Package material characterization frequency dependent model; skin effects, smoothness, roughness, dielectric loss and dielectric constant

· PCB material characterization frequency dependent; routing degree of freedom

· Time domain analyses and jitter budgeting for PCIe2/3/4/5, Serdes 112 GBps, Ethernet 25 Gbps, LPDDR4/5X MIPI, high-speed frequency signaling

· Time domain analyses and budgeting model for LPDDR 3/4/5, LPDDRX 3/4/5/6

· Bathtub curve and BER analyses of high speed signaling

· DDR frequency and time domains model and jitter analyses and path findings to improve package and PCB layout and improve high-speed interconnections

· Clk jitter analyses, routing, clk tree analyses

· Simulating multi-physics electro-thermal analysis

· Collateral packaging manufacturing and assembly rules

· Chip and package Reliability analyses

· Die+Pkg+pcb PDN model time and frequency, Impedance profile, AC droop, DC drop DC, etc.

· IR drop, and CPM (chip power model) die model using Redhawk and other tolls

· Core PI: simulation capability, tool/flow and past experience on measurement capability, lab tool set up.