Leidos Holding
Microelectronics ASIC Design Engineer
Leidos Holding, Arlington, VA
Description
The EW Division of Leidos is looking for a Microelectronics Design Engineer to work with a multi-disciplined design team (electrical engineers, systems engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital Signal Processing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will also support integration, test, and verification in the final products.
Primary Responsibilities:
Basic Qualifications:
Preferred Qualifications:
LInC
Electronic Warfare
Original Posting Date: 2024-10-14While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.
Pay Range: Pay Range $81,250.00 - $146,875.00
The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.
About Leidos Leidos is a Fortune 500® innovation company rapidly addressing the world's most vexing challenges in national security and health. The company's global workforce of 47,000 collaborates to create smarter technology solutions for customers in heavily regulated industries. Headquartered in Reston, Virginia, Leidos reported annual revenues of approximately $15.4 billion for the fiscal year ended December 29, 2023. For more information, visit www.Leidos.com .
Pay and Benefits Pay and benefits are fundamental to any career decision. That's why we craft compensation packages that reflect the importance of the work we do for our customers. Employment benefits include competitive compensation, Health and Wellness programs, Income Protection, Paid Leave and Retirement. More details are available here .
Securing Your Data Beware of fake employment opportunities using Leidos' name. Leidos will never ask you to provide payment-related information during any part of the employment application process (i.e., ask you for money), nor will Leidos ever advance money as part of the hiring process (i.e., send you a check or money order before doing any work). Further, Leidos will only communicate with you through emails that are generated by the Leidos.com automated system - never from free commercial services (e.g., Gmail, Yahoo, Hotmail) or via WhatsApp, Telegram, etc. If you received an email purporting to be from Leidos that asks for payment-related information or any other person a l information (e.g., about you or your previous employer), and you are concerned about its legitimacy, please make us aware immediately by emailing us at [email protected] .
If you believe you are the victim of a scam, contact your local law enforcement and report the incident to the U.S. Federal Trade Commission .
Commitment to Diversity All qualified applicants will receive consideration for employment without regard to sex, race, ethnicity, age, national origin, citizenship, religion, physical or mental disability, medical condition, genetic information, pregnancy, family structure, marital status, ancestry, domestic partner status, sexual orientation, gender identity or expression, veteran or military status, or any other basis prohibited by law. Leidos will also consider for employment qualified applicants with criminal histories consistent with relevant laws.
The EW Division of Leidos is looking for a Microelectronics Design Engineer to work with a multi-disciplined design team (electrical engineers, systems engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital Signal Processing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will also support integration, test, and verification in the final products.
Primary Responsibilities:
- The successful candidate will support technical and programmatic assessments of technologies, capabilities, materials, equipment, and performers in support of the advancement of the U.S. Defense Industrial Base's (DIB) access to trusted, state-of-the-art microelectronics.
- This position will interface and collaborate with a range of engineers, scientists, policy makers, and executives within the government, industry and academia across the country.
- Provide occasional technical support and/or field support planning, and other field support in general if needed.
- Conduct experimental tests on latest SoC evaluation boards, evaluate results, and then develop specifications for selecting next-generation components for deliverable systems.
- Interact with outside customers, suppliers, and functional peer groups.
- Some travel and work at remote sites for limited time periods may be occasionally required.
- Provide status reports to project managers and/or division production manager as required.
Basic Qualifications:
- U.S. Citizenship with the ability to obtain a TS clearance
- BS and 4 years required. Masters Degree in Electrical Engineering, Computer Engineering, Computer Science or related technical discipline desired with 6+ years of experience
- Experience with DSP fundamentals and FPGA implementation
- Experience with Matlab/Simulink
- Experience with microchip EDA tools and flows (Synopsys, Cadence, etc.)
- Microelectronics hardware subject matter expertise in at least (1) of the areas listed below AND experience in (1) additional area listed below:
- Microelectronics Supply Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction)
- Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.)
- Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability)
- Hardware Programming: FPGA (i.e. Verilog, VHDL), Programming (Linux command line/scripting, Python, Java, and C++)
Preferred Qualifications:
- Experience in hardware test and measurement and hands-on lab debug
- Experience with interfaces: ADC/DACs, SerDes, PCIe, JTAG, DDRx
LInC
Electronic Warfare
Original Posting Date: 2024-10-14While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.
Pay Range: Pay Range $81,250.00 - $146,875.00
The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.
About Leidos Leidos is a Fortune 500® innovation company rapidly addressing the world's most vexing challenges in national security and health. The company's global workforce of 47,000 collaborates to create smarter technology solutions for customers in heavily regulated industries. Headquartered in Reston, Virginia, Leidos reported annual revenues of approximately $15.4 billion for the fiscal year ended December 29, 2023. For more information, visit www.Leidos.com .
Pay and Benefits Pay and benefits are fundamental to any career decision. That's why we craft compensation packages that reflect the importance of the work we do for our customers. Employment benefits include competitive compensation, Health and Wellness programs, Income Protection, Paid Leave and Retirement. More details are available here .
Securing Your Data Beware of fake employment opportunities using Leidos' name. Leidos will never ask you to provide payment-related information during any part of the employment application process (i.e., ask you for money), nor will Leidos ever advance money as part of the hiring process (i.e., send you a check or money order before doing any work). Further, Leidos will only communicate with you through emails that are generated by the Leidos.com automated system - never from free commercial services (e.g., Gmail, Yahoo, Hotmail) or via WhatsApp, Telegram, etc. If you received an email purporting to be from Leidos that asks for payment-related information or any other person a l information (e.g., about you or your previous employer), and you are concerned about its legitimacy, please make us aware immediately by emailing us at [email protected] .
If you believe you are the victim of a scam, contact your local law enforcement and report the incident to the U.S. Federal Trade Commission .
Commitment to Diversity All qualified applicants will receive consideration for employment without regard to sex, race, ethnicity, age, national origin, citizenship, religion, physical or mental disability, medical condition, genetic information, pregnancy, family structure, marital status, ancestry, domestic partner status, sexual orientation, gender identity or expression, veteran or military status, or any other basis prohibited by law. Leidos will also consider for employment qualified applicants with criminal histories consistent with relevant laws.