Futran Tech Solutions Pvt. Ltd.
Senior PCB eCAD Design Engineer
Futran Tech Solutions Pvt. Ltd., New Freedom, PA
Top 3 Skills -
1. PCB eCAD Design expert, Schematic drafting using DX Designer, PCB library creation
2. Mentor Graphics - Xpedition
3. High speed, HDI Design, DFA-DFM standards, IPC standards.
Key Skills: PCB eCAD PCB Designer; Mentor Graphics Xpedition
Experience:
PCB layout Designing of Analog, Digital & Mixed signal PCB's
7+ years in PCB eCAD Multilayer PCB Layout designing.
PCB EDA tool Mentor Graphics Xpedition (Mandatory) Other tools knowledge will be added advantage (Altium, Cadence).
Library development & Validation.
Primary Skills:
PCB Layout process flow, Library development and validation; Schematic capture; Part Placement; Constraints setting Electrical/DFA/DFM; Power split plan; Routing; Controlled impedance Length tuning & Post Gerber process.
Secondary skills:
HDI Techniques; Blind / Buried VIA; High speed interface peripherals; DFX guidelines & Validation; SI/PI guidelines & validation; Layer stack-up define & Calculation.
Roles & Responsibilities:
Designing of compact, high density, and high component count PCB layouts.
Expertise in analyzing PCB feasibility - Layers / PCB size optimization activities.
Closely interact with cross functional teams (HW, Mechanical, SI-PI & FAB house)
Good Communication skills - both verbal & written.
Must be open to work other time zones & Clint locations on need basis.
Qualification: BE in EEE / ECE
1. PCB eCAD Design expert, Schematic drafting using DX Designer, PCB library creation
2. Mentor Graphics - Xpedition
3. High speed, HDI Design, DFA-DFM standards, IPC standards.
Key Skills: PCB eCAD PCB Designer; Mentor Graphics Xpedition
Experience:
PCB layout Designing of Analog, Digital & Mixed signal PCB's
7+ years in PCB eCAD Multilayer PCB Layout designing.
PCB EDA tool Mentor Graphics Xpedition (Mandatory) Other tools knowledge will be added advantage (Altium, Cadence).
Library development & Validation.
Primary Skills:
PCB Layout process flow, Library development and validation; Schematic capture; Part Placement; Constraints setting Electrical/DFA/DFM; Power split plan; Routing; Controlled impedance Length tuning & Post Gerber process.
Secondary skills:
HDI Techniques; Blind / Buried VIA; High speed interface peripherals; DFX guidelines & Validation; SI/PI guidelines & validation; Layer stack-up define & Calculation.
Roles & Responsibilities:
Designing of compact, high density, and high component count PCB layouts.
Expertise in analyzing PCB feasibility - Layers / PCB size optimization activities.
Closely interact with cross functional teams (HW, Mechanical, SI-PI & FAB house)
Good Communication skills - both verbal & written.
Must be open to work other time zones & Clint locations on need basis.
Qualification: BE in EEE / ECE