Western Digital Capital is hiring: Wet Process Development Engineer, Hardware De

Wet Process Development Engineer, Hardware Development Engineering

• Full-time
• Job Type (exemption status): Exempt position - Please see related compensation & benefits details below
• Salary Range: 117,300.00-166,200.00
• Business Function: Hardware Development Engineering
• Work Location: Fremont Office--LOC_WDT_USCA13

At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.

We are seeking a talented and driven Process Development Engineer specializing in wafer wet process development (Chemical Mechanical Planarization (CMP), and Wet Process Development). Your role will involve enabling and accelerating HAMR technology deployment into HDD products. This position requires flexibility to work a five-day schedule, including weekends.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Partner with wafer wet process development engineers and technicians responsible for new process development, methodology setup, consumables, and advance tooling delivery to meet new product launch requirement, schedule, and manufacturability.
• Work with cross functional teams including design, integration, and other development process modules on designs incorporating wet process on resolving any integration issue.
• Lead on trouble-shoot the related issues in development line, conduct defect analyses, root cause analyses, and implement corrective and preventive actions.
• Responsible for new process to manufacturing engineering (ME) transferring, support ME team on necessary process implementing and manufacturing ramping.
• Apply quantitative analysis and novel machine learning technology for wafer wet process module data analysis. Build statistically solutions to provide feedback guidance to improve process development performance.

REQUIRED:

• MS, or PhD degree in chemistry, chemical engineering, materials science, or a related engineering field.
• Understanding microelectronics wafer fabrication process including CMP, photolithography, dry or wet etching, electroplating, or thin film deposition processes.

PREFERRED:

• Strong hand-on experience and willing to work in wafer fab.

SKILLS:

• Excellent communication skills, both written and oral. Able to work on the resolution of any issue and to interact with various interdepartmental team and support organizations.

Working Hours:

• 5-day workweek, including weekend days (e.g., Wednesday to Sunday or Saturday to Wednesday).

Western Digital is committed to providing equal opportunities to all applicants and employees and will not discriminate based on their race, color, ancestry, religion, sex, gender, age, national origin, sexual orientation, medical condition, marital status, physical disability, mental disability, or other legally protected characteristics. We also prohibit harassment of any individual on any of the characteristics listed above.

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.