Fox Point Recruitment LLC
Principal Analog Mixed-Signal Design Engineer
Fox Point Recruitment LLC, Santa Clara, California, us, 95053
Principal Analog Mixed-Signal Design Engineer
Job Locations: Hybrid - 2 days a week minimum in one of these office Locations: Westlake Village, CA Irvin, CA Job Summary Our client is seeking an RF and Analog Design Engineer to contribute to the development of multi-tens of GHz Transimpedance amplifiers (TIAs). As a member of the design group, the candidate will be responsible for design and validation of FET and BiCMOS circuits for high-speed broadband ICs that serve these applications. Responsibilities Active circuit design as well as technical leadership. Designing leading edge transimpedance amplifier design, primarily in Silicon Germanium (SiGe) BiCMOS technology, where circuit performance will need to transcend beyond industry leading products. Developing transmission line structures and other millimeter wave structures to enable higher performance than would normally be achievable. Design of high-performance broadband analog circuits for optical front-end receivers. Design of various other analog circuits including linear regulators, AGC loop, current/voltage sensors, bandgaps, etc. Developing microarchitecture of major circuit blocks and guiding a team of designers to implement them. Work with various technologies including SiGe BiCMOS and CMOS. Working with other functional groups to facilitate post-silicon validation, qualification, transition to mass production, and customer support. Qualifications & Experience Bachelor's degree in Electrical Engineering in the areas of design of high-performance RF/Analog Receiver/TIA design and 10 - 15 years experience. Or MSc EE or PhD EE with 5+ years of experience in the areas of design of high-performance RF/Analog Receiver/TIA design. Proven experience in IC design including chip tape-out and lab evaluation of receiver design working in the industry. Solid experience in:
Using EDA CAD tools Performing Analog Custom Layout
Experience in measuring IC performance and debugging design to correlate simulations to measurements. Deep understanding of fundamentals, including:
Detailed transistor level design Device physics Control/Feedback loop stability analysis
Direct project experience in at least one of the following areas is a plus:
AGC loop design High precision analog circuits (Including linear regulators, current sensors, bandgaps, and DAC/ADC) Experience in CTLE design
Project experience in using different technologies (SiGe BiCMOS is a plus). Experience in the following is a strong plus:
Overseeing and mentoring junior circuit designers Experience as chip lead with success in silicon Experience in taking chips to mass production Ability to translate chip level specifications into architecture
Strong communication, presentation, and documentation skills. Expected Base Pay Range (USD) 145,300 - 215,010 per annum. The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location, and market conditions. The expected base pay range for this role may be modified based on market conditions. Additional Compensation and Benefit Elements Our client offers a total compensation package with a base, bonus, and equity. Health and financial wellbeing are part of the package, including flexible time off, 401k, a year-end shutdown, floating holidays, and paid time off to volunteer. This role is eligible for our hybrid work model, allowing you to split time between working from home and on-site in the office. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability, or protected veteran status.
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Job Locations: Hybrid - 2 days a week minimum in one of these office Locations: Westlake Village, CA Irvin, CA Job Summary Our client is seeking an RF and Analog Design Engineer to contribute to the development of multi-tens of GHz Transimpedance amplifiers (TIAs). As a member of the design group, the candidate will be responsible for design and validation of FET and BiCMOS circuits for high-speed broadband ICs that serve these applications. Responsibilities Active circuit design as well as technical leadership. Designing leading edge transimpedance amplifier design, primarily in Silicon Germanium (SiGe) BiCMOS technology, where circuit performance will need to transcend beyond industry leading products. Developing transmission line structures and other millimeter wave structures to enable higher performance than would normally be achievable. Design of high-performance broadband analog circuits for optical front-end receivers. Design of various other analog circuits including linear regulators, AGC loop, current/voltage sensors, bandgaps, etc. Developing microarchitecture of major circuit blocks and guiding a team of designers to implement them. Work with various technologies including SiGe BiCMOS and CMOS. Working with other functional groups to facilitate post-silicon validation, qualification, transition to mass production, and customer support. Qualifications & Experience Bachelor's degree in Electrical Engineering in the areas of design of high-performance RF/Analog Receiver/TIA design and 10 - 15 years experience. Or MSc EE or PhD EE with 5+ years of experience in the areas of design of high-performance RF/Analog Receiver/TIA design. Proven experience in IC design including chip tape-out and lab evaluation of receiver design working in the industry. Solid experience in:
Using EDA CAD tools Performing Analog Custom Layout
Experience in measuring IC performance and debugging design to correlate simulations to measurements. Deep understanding of fundamentals, including:
Detailed transistor level design Device physics Control/Feedback loop stability analysis
Direct project experience in at least one of the following areas is a plus:
AGC loop design High precision analog circuits (Including linear regulators, current sensors, bandgaps, and DAC/ADC) Experience in CTLE design
Project experience in using different technologies (SiGe BiCMOS is a plus). Experience in the following is a strong plus:
Overseeing and mentoring junior circuit designers Experience as chip lead with success in silicon Experience in taking chips to mass production Ability to translate chip level specifications into architecture
Strong communication, presentation, and documentation skills. Expected Base Pay Range (USD) 145,300 - 215,010 per annum. The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location, and market conditions. The expected base pay range for this role may be modified based on market conditions. Additional Compensation and Benefit Elements Our client offers a total compensation package with a base, bonus, and equity. Health and financial wellbeing are part of the package, including flexible time off, 401k, a year-end shutdown, floating holidays, and paid time off to volunteer. This role is eligible for our hybrid work model, allowing you to split time between working from home and on-site in the office. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability, or protected veteran status.
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