RF-mmWave Packaging Engineer

Location: Sunnyvale, CA Responsibilities: Design, simulate and validate advanced RF/mmWave/IPD solutions from prototype to mass production. Partner with 3rd party vendors to manufacture and qualify the RFmmWaveF package with high yield. Ensure seamless integration of the RF packages into our system, including reliability and manufacturability. RF lab debug, tuning and characterization of RFmmWave packages. Understand vendor's technology/capabilities and down-select suitable vendors for implementation. Minimum Qualification: BSEE or MSEE in Electric/Electronic Engineering with at least 5 years of RF/mmWave packaging engineer. Excellent knowledge/experience in the following area: wafer level packaging, including RDL design, Silicon/LTCC/TFS passive design, including IPDs, FEM package design, SAW/BAW filters package design, or mmWave package design, including design of mmWave components on substrate. Excellent knowledge/experience of RF/mmWave measurement techniques and lab equipment, including load pull techniques and RF/mmWave probe station. Good understanding of wireless standards and compliance requirements (e.g. FCC). Excellent understanding of RF concepts such as power and noise matching, Smith charts, coupling, supply isolation, radar, de-sense, power supply rejection, transmission lines and mmWave components (e.g. coupler, filters, etc.) Experienced in developing test plans, test procedures, and compliance matrices. Familiar with circuit simulation tools (e.g. ADS), EM tools (e.g. HFSS), PCB design and layout tools (e.g. Allegro), and scripting languages (e.g. Python). Knowlege of wireless standards and wireless systems (e.g. WiFi/BT, Radar, Cellular, GNSS, UWB) Excellent verbal and written communication skills, interpersonal skills, problem solving skills, and team player.