Principal Electrical Engineer - Signal Integrity/Power Integrity

Principal Electrical Engineer - Signal Integrity/Power Integrity

United States, California, Mountain View

Overview: The Mixed Reality (Hololens) Electrical Engineering Team (located in Mountain View, CA) is responsible for taking ideas off the drawing board and turning them into finished products. We design from the ground up boards, flexes, batteries, and cables, and combine them into a product. We then support design validation and new product integration through manufacturing ramp. If you are excited to work on the future of computing, please apply. We are looking for a Principal Electrical Engineer - Signal Integrity/Power Integrity to perform design analysis in cutting-edge products. The candidate will have a deep understanding of electromagnetics, SI/PI, and strong electrical engineering fundamentals between system architecture, mechanical, and software. Microsoft's mission is to empower every person and every organization on the planet to achieve more. As employees, we come together with a growth mindset, innovate to empower others, and collaborate to realize our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.

Responsibilities:

1. Electrical System Design: Engineer and architect electrical systems with a focus on enhancing signal and power integrity.
2. Signal Integrity Analysis: Lead and conduct comprehensive signal integrity assessments, including measurements and correlations, for a variety of high-speed channels such as LPDDR, PCIe, DisplayPort, Thunderbolt, USB, MIPI, and other SERDES standards.
3. Power Integrity Analysis: Lead and conduct power integrity evaluations for essential power and ground domains, including die-package Printed Circuit Board (PCB) co-simulation, selection and positioning of decoupling capacitors, and optimization of power distribution network (PDN) impedance.
4. High-Speed Channel Validation: Verify high-speed channel designs through S-parameter and eye diagram measurements.
5. Signal and Power Solution Development: Develop innovative signal and power solutions that align with the design goals of performance efficiency and cost-effectiveness.
6. PCB Layout Reviews: Execute thorough reviews of rigid Multilayer Board (MLB), Flex PCB (FPC), and Rigid Flex PCB (RFPC) layouts.
7. Cross-Functional Collaboration: Engage closely with multidisciplinary teams to analyze failures in high-speed interfaces and devise solutions to improve design quality and dependability.
8. Electromagnetic Compatibility / Electromagnetic Interference (EMC/EMI): Mitigate RF desense.

Embody our Culture and Values

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