Qualcomm
FEA Engineer
Qualcomm, Santa Clara, California, us, 95053
Company:
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > Systems Engineering
General Summary:
Qualcomm Data Center team is developing high-performance, energy-efficient server solutions for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work!
Our Mission:
We are dedicated to transforming the industry by reimagining silicon and developing next-generation computing platforms. By joining our team, you’ll collaborate with world-class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability. Our focus is on developing reference platforms based on Qualcomm's Snapdragon SoC, delivering a comprehensive solution that includes hardware, software, reference designs, user guides, SDKs, and more.
Position: FEA Engineer
As an experienced
FEA Engineer
(individual contributor), you will play a pivotal role within the platform team developing high-performance servers, collaborating with cross-functional teams, including packaging, electrical, thermal, mechanical, and component suppliers. You will be responsible for structural modeling, testing, and characterization of advanced server processors and high-performance computing systems from die to system level. Key Responsibilities: Perform advanced numerical modeling to analyze and optimize the reliability and manufacturability of server packages and system designs. Support the mechanical design of packages and systems from initial concept through detailed design and manufacturing readiness. Collaborate with internal teams to provide technical guidance, ensuring alignment with mechanical, reliability, and cost requirements. Conduct measurements and experiments to validate models, continuously enhancing their accuracy and robustness. Develop and maintain documentation, guidelines, and tools to support the design process and project success. Prepare and present technical documentation and reports to stakeholders, including engineering teams, senior management, customers, and suppliers. Minimum Qualifications: Master’s degree in Mechanical Engineering, Engineering Mechanics, Material Science, Physics, or a related field. 6+ years of hands-on experience in FEA modeling within the high-tech industry. Proficiency in major FEA tools (e.g., ANSYS, ABAQUS, Hypermesh, or equivalent). Experience in FEA modeling for microelectronics packaging, interconnects, sockets, BGAs, and board/system level. Ability to interpret complex numerical simulation results through fundamental engineering principles. Understanding of semiconductor processing, packaging techniques, materials, and server design considerations. Familiarity with reliability modeling for sockets, BGAs, and microelectronics packaging. Experience in designing and executing validation tests to verify analytical models and calibrate results with empirical data. Proven ability to work independently and collaboratively within a cross-functional team environment. Strong technical documentation skills and excellent written and verbal communication. Preferred Qualifications: Ph.D. in Mechanical Engineering, Engineering Mechanics, Material Science, Physics, or a related field. 10+ years of hands-on experience in FEA modeling within the high-tech industry. Expertise in structural FEA tools (e.g., ANSYS, ABAQUS, Hypermesh, or similar). Extensive experience in holistic structural analysis of die/package/BGA/socket/system structures. Solid understanding of advanced packaging and interconnect reliability modeling at the board/system level, with knowledge of microelectronics reliability testing and methodologies. Understanding of OCP product designs and industry best practices. EEO Employer:
Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
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FEA Engineer
(individual contributor), you will play a pivotal role within the platform team developing high-performance servers, collaborating with cross-functional teams, including packaging, electrical, thermal, mechanical, and component suppliers. You will be responsible for structural modeling, testing, and characterization of advanced server processors and high-performance computing systems from die to system level. Key Responsibilities: Perform advanced numerical modeling to analyze and optimize the reliability and manufacturability of server packages and system designs. Support the mechanical design of packages and systems from initial concept through detailed design and manufacturing readiness. Collaborate with internal teams to provide technical guidance, ensuring alignment with mechanical, reliability, and cost requirements. Conduct measurements and experiments to validate models, continuously enhancing their accuracy and robustness. Develop and maintain documentation, guidelines, and tools to support the design process and project success. Prepare and present technical documentation and reports to stakeholders, including engineering teams, senior management, customers, and suppliers. Minimum Qualifications: Master’s degree in Mechanical Engineering, Engineering Mechanics, Material Science, Physics, or a related field. 6+ years of hands-on experience in FEA modeling within the high-tech industry. Proficiency in major FEA tools (e.g., ANSYS, ABAQUS, Hypermesh, or equivalent). Experience in FEA modeling for microelectronics packaging, interconnects, sockets, BGAs, and board/system level. Ability to interpret complex numerical simulation results through fundamental engineering principles. Understanding of semiconductor processing, packaging techniques, materials, and server design considerations. Familiarity with reliability modeling for sockets, BGAs, and microelectronics packaging. Experience in designing and executing validation tests to verify analytical models and calibrate results with empirical data. Proven ability to work independently and collaboratively within a cross-functional team environment. Strong technical documentation skills and excellent written and verbal communication. Preferred Qualifications: Ph.D. in Mechanical Engineering, Engineering Mechanics, Material Science, Physics, or a related field. 10+ years of hands-on experience in FEA modeling within the high-tech industry. Expertise in structural FEA tools (e.g., ANSYS, ABAQUS, Hypermesh, or similar). Extensive experience in holistic structural analysis of die/package/BGA/socket/system structures. Solid understanding of advanced packaging and interconnect reliability modeling at the board/system level, with knowledge of microelectronics reliability testing and methodologies. Understanding of OCP product designs and industry best practices. EEO Employer:
Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
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