Avicena Inc.
Micro LED Fabrication Engineer
Avicena Inc., Sunnyvale, California, United States, 94087
Avicena
is a privately held company developing microLED-based ultra-low power high bandwidth interconnects for chip-to-chip communications. This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with a track record of delivering breakthrough products. ( www.avicena.tech ) About the role: Develop micro-LED Mass Transfer and related processes for high throughput. Design of Experiments for process optimization to deliver best-in-class defectivity (ppm). Interface with equipment/tooling design, facilities, maintenance, and wafer fab teams to build/install volume-capable equipment set for Mass Transfer. Enforce manufacturing diligence and good engineering practices, including the use of an engineering database for data collection, extraction, and analyses. Devise new and novel metrology methods, interpret data, and prepare complex data analyses and data-driven reports. Establish and sustain process documentation and standard operating procedures. Hands-on with significant portion of time spent inside the cleanroom. Support the scale up and transfer of technology to HVM partners. Qualifications: BS in Materials Science & Engineering or Mechanical Engineering. 5+ years of related industrial experience. In depth knowledge of solder systems, thermal reflow, laser reflow, characterization of intermetallic films, adhesives, and the latest bonding technologies. Proficient with layout design software tools (e.g., Tanner L-Edit). Ability to identify, troubleshoot, and communicate significantly complex engineering problems. Metrology, automated inspection, and FA techniques. Comfortable with cleanroom protocols. Familiarity with health and safety regulations. Preferred Qualifications: MS in Engineering. 10+ years of related industrial experience. Optical-based metrologies. Design of Experiments methodologies. Proficient with JMP software. Computer modeling and simulation (optical, thermo-mechanical) desired, but not required. Working level knowledge of WL-CSP, Wafer Level Packaging, 2.5D packaging and 3D packaging technology desired, but not required. Direct experience with Micro-LED Mass Transfer technology desired, but not required.
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is a privately held company developing microLED-based ultra-low power high bandwidth interconnects for chip-to-chip communications. This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with a track record of delivering breakthrough products. ( www.avicena.tech ) About the role: Develop micro-LED Mass Transfer and related processes for high throughput. Design of Experiments for process optimization to deliver best-in-class defectivity (ppm). Interface with equipment/tooling design, facilities, maintenance, and wafer fab teams to build/install volume-capable equipment set for Mass Transfer. Enforce manufacturing diligence and good engineering practices, including the use of an engineering database for data collection, extraction, and analyses. Devise new and novel metrology methods, interpret data, and prepare complex data analyses and data-driven reports. Establish and sustain process documentation and standard operating procedures. Hands-on with significant portion of time spent inside the cleanroom. Support the scale up and transfer of technology to HVM partners. Qualifications: BS in Materials Science & Engineering or Mechanical Engineering. 5+ years of related industrial experience. In depth knowledge of solder systems, thermal reflow, laser reflow, characterization of intermetallic films, adhesives, and the latest bonding technologies. Proficient with layout design software tools (e.g., Tanner L-Edit). Ability to identify, troubleshoot, and communicate significantly complex engineering problems. Metrology, automated inspection, and FA techniques. Comfortable with cleanroom protocols. Familiarity with health and safety regulations. Preferred Qualifications: MS in Engineering. 10+ years of related industrial experience. Optical-based metrologies. Design of Experiments methodologies. Proficient with JMP software. Computer modeling and simulation (optical, thermo-mechanical) desired, but not required. Working level knowledge of WL-CSP, Wafer Level Packaging, 2.5D packaging and 3D packaging technology desired, but not required. Direct experience with Micro-LED Mass Transfer technology desired, but not required.
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