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Lotus Technology Group, Inc.

Sr. Design Engineer, Electronics Packaging

Lotus Technology Group, Inc., Southfield, MI, United States


Job Title: Sr. Design Engineer, Electronics Packaging
Select employment type: Fulltime
Locations: Southfield, MI

About the client:-
Our client is a global leader in Engineering and R&D (ER&D) services. With 976 patents filed for 57 of the Global Top 100 ER&D spenders, the client lives and breathes engineering. Some of their innovations include World's 1st Autonomous Welding Robot, Solar 'Connectivity' Drone, and the Smartest Campus in the World, to name a few.

Their expertise in engineering design, product development, smart manufacturing, and digitalization touches every area of human lives - from the moment one wakes up till the time one goes to bed. With 110 Innovation and R&D design centers globally, the client specializes in disruptive technology spaces such as 5G, Artificial Intelligence, Collaborative Robots, Digital Factory, and Autonomous Transport.

Our client is a publicly listed subsidiary of a well-respected $21 billion conglomerate operating in over 30 countries

About us:
Lotus TG delivers exceptional IT services and solutions that provide clients with definite edge over competitors and promoting highest standards of quality. We have strong and long established tie ups with IT Integrators and end customers specializing in Technology product/service providers.

Job Description-
Senior Mechanical Engineer with experience in Mechanical Design Engineering. The position will be part
of the Low Voltage Hardware Mechanical team, which is responsible for developing the Infotainment
ECUs, Power distribution modules and Gateway ECUs. Resource will interact with electrical engineers,
layout engineers, thermal engineers, SI engineers, embedded system engineers, technical program
managers internally and various vendors externally to ensure high quality components are designed.
Role:
  • Work with cross functional vehicle integration teams to come up with the detailed requirements to
  • design systems/part that are Electro-mechanical in functionality.
  • Working closely with Packaging team to understand the vehicle level packaging location and verify the
  • thermal performance of the ECUs
  • Design 3D, 2D models with Manufacturing tolerances accounted for a good DFM, and DFA
  • Work with Tier1/2/Contract Manufacturers vendors on component development plan, clarifying
  • technical queries,
  • Perform CAE Analysis for Structural integrity and Design optimization, work with the Thermal engineer
  • to get the design verified for Thermal management
  • Work with EE Engineers to design the Board layout for components placement
  • Design Electro-Mechanical system such as Interconnects, Pins for PCBA side.
  • Work with the Environmental Test team and Vehicle Test teams to design the Test plans to validate the
  • design at component, system, and Vehicle level to release reliable and Durable design
  • Work with EE to finalize the connectors based on the requirements established for a particular ECU
  • Work with Supply chain team, to assess old and new suppliers for the project to get Cost effective,
  • Quality Soft tooled, Hard Tooled parts on Time as per the Program team.
Qualifications:
  • BS or MS degree in Mechanical Engineering with at least 4 years of Industry relevant experience
  • Knowledge with different levels of Electronics packaging. Preferable Level 4 packaging
  • Proficiency in Mechanical Design, Manufacturing process, with heat transfer basics
  • Demonstrate full ownership of assigned systems/components
  • Experience with System validation and instrumentation
Advantageous:
  • Positive Attitude to own the design, development and production of various parts