TSMC Arizona Corporation
Product Design Engineer, Yield & Quality (Multiple Positions)
TSMC Arizona Corporation, Phoenix, Arizona, United States, 85099
40 hrs/week, Mon-Fri, 8:30 a.m. - 5:30 p.m.
MINIMUM REQUIREMENTS:
Must have a Bachelors degree or foreign equivalent in Electrical Engineering, Chemical Engineering, Materials Science and Engineering, Mechanical Engineering, Physics or a related field, plus 2 years of experience in an engineering role.
Must have education or experience in at least 2 of the following: Design of Experiment (DOE); semiconductor fabrication; statistical process control; or statistical methods for modeling multivariate data sets.
Must have education or experience in at least one (1) of the following: - semiconductor physics, CMOS device operation, or advanced semiconductor manufacturing; - VLSI circuit design; or - Design for Test (DFT) or VLSI CP test methodology.
Must have education or experience in at least 3 of the following metrology used in semiconductor processing: Transmission Electron Microscopy (TEM); Scanning Electron Microscopy (SEM); Critical Dimension SEM (CD-SEM); Energy Dispersive X-ray Spectroscopy (EDS); Focused Ion Beam (FIB); Atomic Force Microscopy (AFM); X-ray Diffraction (XRD); Emission Spectroscopy; Raman Spectroscopy; Spectroscopic Ellipsometry; Quartz PCI; or Fourier Transform Infrared Spectroscopy (FT-IR).
Experience may be gained while in graduate school.
Requires up to 75% international and domestic travel.
Please email resume to and reference Job #9995.
MINIMUM REQUIREMENTS:
Must have a Bachelors degree or foreign equivalent in Electrical Engineering, Chemical Engineering, Materials Science and Engineering, Mechanical Engineering, Physics or a related field, plus 2 years of experience in an engineering role.
Must have education or experience in at least 2 of the following: Design of Experiment (DOE); semiconductor fabrication; statistical process control; or statistical methods for modeling multivariate data sets.
Must have education or experience in at least one (1) of the following: - semiconductor physics, CMOS device operation, or advanced semiconductor manufacturing; - VLSI circuit design; or - Design for Test (DFT) or VLSI CP test methodology.
Must have education or experience in at least 3 of the following metrology used in semiconductor processing: Transmission Electron Microscopy (TEM); Scanning Electron Microscopy (SEM); Critical Dimension SEM (CD-SEM); Energy Dispersive X-ray Spectroscopy (EDS); Focused Ion Beam (FIB); Atomic Force Microscopy (AFM); X-ray Diffraction (XRD); Emission Spectroscopy; Raman Spectroscopy; Spectroscopic Ellipsometry; Quartz PCI; or Fourier Transform Infrared Spectroscopy (FT-IR).
Experience may be gained while in graduate school.
Requires up to 75% international and domestic travel.
Please email resume to and reference Job #9995.