Northrop Grumman Corp. (AU)
Principal/Sr. Principal Engineer RF Microwave Design
Northrop Grumman Corp. (AU), Baltimore, Maryland, United States, 21276
Requisition ID: R10169829
Category:
Engineering
Location:
Baltimore, Maryland, United States of America
Clearance Type:
Secret
Telecommute:
No - Teleworking not available for this position
Shift:
1st Shift (United States of America)
Travel Required:
Yes, 10% of the Time
Relocation Assistance:
Relocation assistance may be available
Positions Available:
3
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history. We look for people who have bold new ideas, courage, and a pioneering spirit to join forces to invent the future, and have fun along the way.
AMS E&S is seeking engineers with experience and interest in electronic assembly and packaging design.
What You’ll get to Do:
Designing, modeling, and verifying RF/microwave, and mixed signal assemblies and subsystems
Utilizing analysis, simulations, and prototyping to develop antenna and signal conversion designs
Deriving and trading requirements with components, assembly, and subsystem engineers
Performing electromagnetic simulation of component, assembly, and subsystem level performance
Managing RF budgets, frequency planning, and common assembly level interfaces
Predicting assembly level performance through selecting materials, components, and packaging approaches
Developing custom RF integrated circuit designs to meet assembly and subsystem level requirements
Collaborating with peer functions such as Mechanical, Manufacturing, Quality, Supply Chain, and Test
Utilizing world-class manufacturing capabilities for prototyping through full rate production
Working directly with a wide variety of external supplier partners
Supporting products throughout the product life cycle
RF and mixed signal assembly product types include antenna radiators, circulators, device interposers, filters, manifolds, receiver/exciter assemblies, signal conditioning assemblies, signal generators, and transmit/receive assemblies
RF and mixed signal subsystem product types include antenna and receiver/exciter subsystems
Basic Qualifications for Principal Engineer:
Electrical Engineering or related STEM field degree: Bachelor of Science with 5 years of RF/microwave experience; Masters degree with 3 years of RF/microwave experience; or PhD degree. An additional 4 years of experience will be considered in lieu of a degree.
US Citizenship is required
Must have Full Secret Clearance Minimum Prior to start
Ability to provide sound solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty
Developing subject matter expertise in RF/Microwave discipline
Exhibit intermediate to expert proficiency with industry standard RF/Microwave modeling, simulation, and printed circuit board design tools
Proven knowledge of electrical engineering design software and equipment
Basic Qualifications for Senior Principal Engineer:
Electrical Engineering or related STEM field degree: Bachelor of Science with 8 years of RF/microwave experience; Masters degree with 6 years of RF/microwave experience; PhD degree with 3 years of experience. An additional 4 years of experience will be considered in lieu of a degree.
US Citizenship is required.
Must have Full Secret Clearance Minimum Prior to start
Ability to provide innovative solutions to RF/Microwave design and test related problems of complex difficulty
Demonstrated subject matter expertise in RF/Microwave discipline
Exhibit expert proficiency with industry standard RF/Microwave modeling, simulation, and printed circuit board design tools
Expert knowledge of electrical engineering design software and equipment.
Preferred Qualifications for both roles:
Top Secret / SCI security clearance
RF and mixed signal printed circuit board and circuit card assembly designs
RF budgeting, frequency planning, and modeling
Component selection and/or custom component requirements
Ceramic and organic printed circuit board materials and processes
Integrated Circuit packaging techniques
RF lab equipment experience
Antenna Range Testing
Electronic troubleshooting skills
Complex data reduction and analysis
Product life cycle support experience
Designing for high reliability and mil/aero requirements
Experience in the Aerospace or Defense Industry
Proficiency in relevant software tools
This role is contingent upon a Final Clearance to start.
Salary Range:
$102,400 - $153,600
The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers.
Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer.
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Category:
Engineering
Location:
Baltimore, Maryland, United States of America
Clearance Type:
Secret
Telecommute:
No - Teleworking not available for this position
Shift:
1st Shift (United States of America)
Travel Required:
Yes, 10% of the Time
Relocation Assistance:
Relocation assistance may be available
Positions Available:
3
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history. We look for people who have bold new ideas, courage, and a pioneering spirit to join forces to invent the future, and have fun along the way.
AMS E&S is seeking engineers with experience and interest in electronic assembly and packaging design.
What You’ll get to Do:
Designing, modeling, and verifying RF/microwave, and mixed signal assemblies and subsystems
Utilizing analysis, simulations, and prototyping to develop antenna and signal conversion designs
Deriving and trading requirements with components, assembly, and subsystem engineers
Performing electromagnetic simulation of component, assembly, and subsystem level performance
Managing RF budgets, frequency planning, and common assembly level interfaces
Predicting assembly level performance through selecting materials, components, and packaging approaches
Developing custom RF integrated circuit designs to meet assembly and subsystem level requirements
Collaborating with peer functions such as Mechanical, Manufacturing, Quality, Supply Chain, and Test
Utilizing world-class manufacturing capabilities for prototyping through full rate production
Working directly with a wide variety of external supplier partners
Supporting products throughout the product life cycle
RF and mixed signal assembly product types include antenna radiators, circulators, device interposers, filters, manifolds, receiver/exciter assemblies, signal conditioning assemblies, signal generators, and transmit/receive assemblies
RF and mixed signal subsystem product types include antenna and receiver/exciter subsystems
Basic Qualifications for Principal Engineer:
Electrical Engineering or related STEM field degree: Bachelor of Science with 5 years of RF/microwave experience; Masters degree with 3 years of RF/microwave experience; or PhD degree. An additional 4 years of experience will be considered in lieu of a degree.
US Citizenship is required
Must have Full Secret Clearance Minimum Prior to start
Ability to provide sound solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty
Developing subject matter expertise in RF/Microwave discipline
Exhibit intermediate to expert proficiency with industry standard RF/Microwave modeling, simulation, and printed circuit board design tools
Proven knowledge of electrical engineering design software and equipment
Basic Qualifications for Senior Principal Engineer:
Electrical Engineering or related STEM field degree: Bachelor of Science with 8 years of RF/microwave experience; Masters degree with 6 years of RF/microwave experience; PhD degree with 3 years of experience. An additional 4 years of experience will be considered in lieu of a degree.
US Citizenship is required.
Must have Full Secret Clearance Minimum Prior to start
Ability to provide innovative solutions to RF/Microwave design and test related problems of complex difficulty
Demonstrated subject matter expertise in RF/Microwave discipline
Exhibit expert proficiency with industry standard RF/Microwave modeling, simulation, and printed circuit board design tools
Expert knowledge of electrical engineering design software and equipment.
Preferred Qualifications for both roles:
Top Secret / SCI security clearance
RF and mixed signal printed circuit board and circuit card assembly designs
RF budgeting, frequency planning, and modeling
Component selection and/or custom component requirements
Ceramic and organic printed circuit board materials and processes
Integrated Circuit packaging techniques
RF lab equipment experience
Antenna Range Testing
Electronic troubleshooting skills
Complex data reduction and analysis
Product life cycle support experience
Designing for high reliability and mil/aero requirements
Experience in the Aerospace or Defense Industry
Proficiency in relevant software tools
This role is contingent upon a Final Clearance to start.
Salary Range:
$102,400 - $153,600
The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers.
Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer.
#J-18808-Ljbffr