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Apple Inc.

Module Design Manager

Apple Inc., Cupertino, California, United States, 95014


Imagine what you can do here. Apple is a place where extraordinary people gather to do their lives best work. Together we create products and experiences people once couldn’t have imagined, and now, can’t imagine living without. It’s the diversity of those people and their ideas that inspires the innovation that runs through everything we do.DescriptionAPPLE INC has the following available in Cupertino, California and various unanticipated locations throughout the USA. Supervise a team of engineers and execute on projects by establishing project objectives, tasks, and duties related to camera module design. Utilize knowledge of camera design and relevant mechanical and electrical CAD tools, oversee the design and development of camera modules for consumer electronic devices, and design of future camera technologies including compact imaging optics, image sensors, light emitting devices, and electronic circuits. Define and refine engineering requirements of high-precision, high-volume modules, and manufacturing process and lead camera testing in camera labs and manufacturing sites. Lead analysis and define trade studies of components and materials such as semiconductor components, plastics, metals, and epoxies for appropriate selection for camera designs manufactured in high volume. Lead the failure/defect analysis of optical, mechanical, material, and electrical camera failures through wide range of characterization tools like X-ray, SEM, FTIR, CT, FIB, and EDX. Conduct Image quality evaluations through various image processing analysis and techniques, and statistical data analysis and correlation studies with large data sets utilizing JMP, Matlab, Python. Lead automation of lab validation activities for large scale data collection utilizing test tools through matlab and python scripting. International and domestic travel required 10%. 40 hours/week. At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $223,329 - $329,600/yr and your base pay will depend on your skills, qualifications, experience, and location.Minimum QualificationsBachelor’s degree or foreign equivalent in Mechatronics Engineering, Mechanical Engineering, Electrical Engineering, Nanotechnology Engineering or related field and 4 years of experience in the job offered or related occupation.4 years of experience with each of the following skills is required:Using High volume electronics manufacturing to lead design of camera module components including optics, sensors and packaging.Experience in failure and defect analysis of camera modules through characterization tools: X-ray, SEM, FTIR, CT, FIB, and EDX.Conducting data analysis and statistical analysis with large data sets using MATLAB.Utilizing Matlab and Python for data collection automation and experience with high volume manufacturing of test and data analysis.Experience in material selection and manufacturing processes related to optoelectrics and microelectronics packaging.Experience working with LED and sensor design related to optoelectronics.Designing evaluation, and leading prototype builds and qualification of optoelectronics and microelectronic devices.Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.

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