University of Texas at Arlington
Research Engineering Scientist Associate V
University of Texas at Arlington, Fort Worth, Texas, United States, 76102
Research Engineering Scientist Associate V
Please see Special Instructions for more details.Applicants must include in their online resume the following information: 1) Employment history: name of company, period employed (from month/year to month/year), job title, summary of job duties and 2) Education: school name, degree type, and major.Position InformationPosting Number:
S05121PPosition Title:
Research Engineering Scientist Associate VDepartment:
Mech and Aero EngineeringLocation:
ArlingtonPosition Status:
Full-timeWork Schedule:
Monday through Friday; 8:00am-5:00pmSalary:
Salary is commensurate based on qualifications and relevant experience up to $90,000.We are proud to offer a comprehensive benefits package to all our employees at the University.https://www.uta.edu/hr/employee-benefitsTo help you understand the full value of these benefits, we have created a tool that calculates the total worth of your compensation package. This tool takes into account all of the benefits that you are eligible for, including health insurance, retirement plans, and paid time off. To access this tool and learn more about the total value of your benefits, please click on the following link:https://resources.uta.edu/hr/services/records/compensation-tools.phpUniversity InformationThe University of Texas at Arlington is located in the heart of the Dallas-Fort Worth-Arlington metroplex, a vibrant and diverse metropolitan area that is home to over 7 million people, one of the fastest-growing tech economies in the United States, and a wide array of arts, entertainment, and cultural activities. UTA is a comprehensive teaching, research, and public service institution dedicated to the advancement of knowledge through scholarship and creative work.Job SummaryThe RESA V will conduct research to develop novel techniques for the heterogenous integration of diverse systems in package (2.5D/3.5D) with a focus on the reliability of packages; investigate and identify materials suitable for heterogenous integration, including but not limited to semiconductors, dielectrics and conductors; explore emerging materials for improved performance; Collaborate with cross-functional teams to design, develop, and optimize manufacturing processes for HI, ensuring reliability and scalability; explore advanced interconnection methods and technologies such as through-silicon vias (TSVs), micro bumps, hybrid bonding (metal-metal) for 2.5D/3.5D packaging; and utilize modeling and simulation tools to predict the behavior of integrated systems to identify potential challenges and optimize design.Essential Duties and ResponsibilitiesConduct research in the field of heterogenous integration including but not limited to advanced interconnects such as hybrid bonding, and thermal management using immersion cooling with a focus on reliability.Write proposals, collaborate with PhD students, and write papers.Collaborate with other research partners and explore new test procedures and methodologies.Conduct material characterization for thin films and advanced interconnects.Minimum QualificationsPh.D. in engineering or relevant combination of education and professional certification.Preferred QualificationsPh.D. in mechanical engineering, electrical engineering or relevant combination of education and professional certification with 2 years related research experience.Knowledge, Skills and AbilitiesExperience designing, building and setting micro-electronic reliability test platforms.Experience in process integration and development for advance packaging and interconnects.Experience in Si-photonics integration.Thin film characterization and analysis.Experience with SEM, FIB, Nano-indentation and AES.FEM simulation/modeling.Other RequirementsWorking Conditions:
University research lab environment.CBC Requirement:
It is the policy of The University of Texas at Arlington to conduct a criminal background check on any applicant who is under final consideration for employment with the University.EEO Statement:
It is the policy of The University of Texas at Arlington (UTA or The University) to provide an educational and working environment that provides equal opportunity to all members of the University community.ADA Accommodations:
The University of Texas at Arlington is committed to providing reasonable accommodation to individuals with disabilities.Number of Vacancies:
1Minimum Number of References Required:
3Maximum Number of References Accepted:
5Special Instructions to Applicants:
Applicants must include in their online resume the following information: 1) Employment history: name of company, period employed (from month/year to month/year), job title, summary of job duties and 2) Education: school name, degree type, and major.Requirement Questions
Required fields are indicated with an asterisk (*).* What is your PhD Discipline? (Open Ended Question)
* What certifications, if any, have you obtained? (Open Ended Question)
Documents Needed To Apply
Required DocumentsResume or CVCover/Interest LetterOptional DocumentsOther Document(s)
#J-18808-Ljbffr
Please see Special Instructions for more details.Applicants must include in their online resume the following information: 1) Employment history: name of company, period employed (from month/year to month/year), job title, summary of job duties and 2) Education: school name, degree type, and major.Position InformationPosting Number:
S05121PPosition Title:
Research Engineering Scientist Associate VDepartment:
Mech and Aero EngineeringLocation:
ArlingtonPosition Status:
Full-timeWork Schedule:
Monday through Friday; 8:00am-5:00pmSalary:
Salary is commensurate based on qualifications and relevant experience up to $90,000.We are proud to offer a comprehensive benefits package to all our employees at the University.https://www.uta.edu/hr/employee-benefitsTo help you understand the full value of these benefits, we have created a tool that calculates the total worth of your compensation package. This tool takes into account all of the benefits that you are eligible for, including health insurance, retirement plans, and paid time off. To access this tool and learn more about the total value of your benefits, please click on the following link:https://resources.uta.edu/hr/services/records/compensation-tools.phpUniversity InformationThe University of Texas at Arlington is located in the heart of the Dallas-Fort Worth-Arlington metroplex, a vibrant and diverse metropolitan area that is home to over 7 million people, one of the fastest-growing tech economies in the United States, and a wide array of arts, entertainment, and cultural activities. UTA is a comprehensive teaching, research, and public service institution dedicated to the advancement of knowledge through scholarship and creative work.Job SummaryThe RESA V will conduct research to develop novel techniques for the heterogenous integration of diverse systems in package (2.5D/3.5D) with a focus on the reliability of packages; investigate and identify materials suitable for heterogenous integration, including but not limited to semiconductors, dielectrics and conductors; explore emerging materials for improved performance; Collaborate with cross-functional teams to design, develop, and optimize manufacturing processes for HI, ensuring reliability and scalability; explore advanced interconnection methods and technologies such as through-silicon vias (TSVs), micro bumps, hybrid bonding (metal-metal) for 2.5D/3.5D packaging; and utilize modeling and simulation tools to predict the behavior of integrated systems to identify potential challenges and optimize design.Essential Duties and ResponsibilitiesConduct research in the field of heterogenous integration including but not limited to advanced interconnects such as hybrid bonding, and thermal management using immersion cooling with a focus on reliability.Write proposals, collaborate with PhD students, and write papers.Collaborate with other research partners and explore new test procedures and methodologies.Conduct material characterization for thin films and advanced interconnects.Minimum QualificationsPh.D. in engineering or relevant combination of education and professional certification.Preferred QualificationsPh.D. in mechanical engineering, electrical engineering or relevant combination of education and professional certification with 2 years related research experience.Knowledge, Skills and AbilitiesExperience designing, building and setting micro-electronic reliability test platforms.Experience in process integration and development for advance packaging and interconnects.Experience in Si-photonics integration.Thin film characterization and analysis.Experience with SEM, FIB, Nano-indentation and AES.FEM simulation/modeling.Other RequirementsWorking Conditions:
University research lab environment.CBC Requirement:
It is the policy of The University of Texas at Arlington to conduct a criminal background check on any applicant who is under final consideration for employment with the University.EEO Statement:
It is the policy of The University of Texas at Arlington (UTA or The University) to provide an educational and working environment that provides equal opportunity to all members of the University community.ADA Accommodations:
The University of Texas at Arlington is committed to providing reasonable accommodation to individuals with disabilities.Number of Vacancies:
1Minimum Number of References Required:
3Maximum Number of References Accepted:
5Special Instructions to Applicants:
Applicants must include in their online resume the following information: 1) Employment history: name of company, period employed (from month/year to month/year), job title, summary of job duties and 2) Education: school name, degree type, and major.Requirement Questions
Required fields are indicated with an asterisk (*).* What is your PhD Discipline? (Open Ended Question)
* What certifications, if any, have you obtained? (Open Ended Question)
Documents Needed To Apply
Required DocumentsResume or CVCover/Interest LetterOptional DocumentsOther Document(s)
#J-18808-Ljbffr