Micron
Principal Engineer - HBM Design | Architecture - TPG
Micron, Atlanta, Georgia, United States, 30383
Our vision is to transform how the world uses information to enrich life for
all
.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Our Opportunity Summary:
As an HBM Design Architect, you will be responsible for the design & development of next-generation HBM DRAM products. You will be part of a highly multi-functional team of technical domain experts collaborating closely with a distributed team of Design Engineering, Product Engineering, Process Development, Package Engineering & Business Units to implement a common goal of ensuring our future HBM roadmap is successful. You will apply your deep understanding of memory array architectures, high-speed interface design, logic & custom circuit design, memory subsystem operation, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures to target best-in-class performance, power, cost, reliability and quality for Micron’s HBM product portfolio.
Job title and level can scale depending on experience and qualifications
In HBM DEG (High Bandwidth Memory - DRAM Engineering Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison.
What’s Encouraged Daily:
Pathfinding to explore new architectures for future products and make recommendations after performing highly technical feasibility analyses
Focus areas within the team will include memory array architectures, on-die and off-die high-speed signaling, PHY & interface development, power delivery network planning and optimization, power consumption reduction, CMOS requirements identification, packaging technologies, and thermal modeling
Debug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products and architectures
Engage with Customers to support issues with current HBM architectures and find opportunities to innovate on future HBM solutions
How To Qualify:
Familiarity with DRAM operation and JEDEC specifications, preferably with the HBM product family
Knowledge and experience in digital (Verilog) and analog (FastSpice & Hspice) modeling and simulations
In-depth technical expertise in one or more areas - DRAM memory array design, high-speed clocking and interface development, logic and custom circuit design, power delivery optimization, CMOS & semiconductor device physics, 2.5D and 3D packaging technologies
Proven track record of innovation and problem-solving in high-performance memory development
7+ years of relevant job/skill-related experience
Experience delivering highly technical solutions
What Sets You Apart:
BSEE or greater
In-depth technical expertise in one or more areas: RTL Design flow, in the DRAM process or Foundry process - DRAM product bring-up and debug - package technologies (TSV, hybrid bonding, interposers, etc)
Good verbal and written communication skills with the ability to efficiently synthesize and convey sophisticated technical concepts to other partners and leadership
A self-motivated, hard-working team player who enjoys working with diverse abilities and backgrounds
Having an innovative approach that is open to improving upon any of our processes or products.
Potential Team Member Locations:
Folsom, CA
Atlanta, GA
Allen, TX
The US base salary range that Micron Technology estimates it could pay for this full-time position is: $127,000.00 - $280,000.00
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn more about Micron, please visit micron.com/careers
#J-18808-Ljbffr
all
.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Our Opportunity Summary:
As an HBM Design Architect, you will be responsible for the design & development of next-generation HBM DRAM products. You will be part of a highly multi-functional team of technical domain experts collaborating closely with a distributed team of Design Engineering, Product Engineering, Process Development, Package Engineering & Business Units to implement a common goal of ensuring our future HBM roadmap is successful. You will apply your deep understanding of memory array architectures, high-speed interface design, logic & custom circuit design, memory subsystem operation, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures to target best-in-class performance, power, cost, reliability and quality for Micron’s HBM product portfolio.
Job title and level can scale depending on experience and qualifications
In HBM DEG (High Bandwidth Memory - DRAM Engineering Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison.
What’s Encouraged Daily:
Pathfinding to explore new architectures for future products and make recommendations after performing highly technical feasibility analyses
Focus areas within the team will include memory array architectures, on-die and off-die high-speed signaling, PHY & interface development, power delivery network planning and optimization, power consumption reduction, CMOS requirements identification, packaging technologies, and thermal modeling
Debug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products and architectures
Engage with Customers to support issues with current HBM architectures and find opportunities to innovate on future HBM solutions
How To Qualify:
Familiarity with DRAM operation and JEDEC specifications, preferably with the HBM product family
Knowledge and experience in digital (Verilog) and analog (FastSpice & Hspice) modeling and simulations
In-depth technical expertise in one or more areas - DRAM memory array design, high-speed clocking and interface development, logic and custom circuit design, power delivery optimization, CMOS & semiconductor device physics, 2.5D and 3D packaging technologies
Proven track record of innovation and problem-solving in high-performance memory development
7+ years of relevant job/skill-related experience
Experience delivering highly technical solutions
What Sets You Apart:
BSEE or greater
In-depth technical expertise in one or more areas: RTL Design flow, in the DRAM process or Foundry process - DRAM product bring-up and debug - package technologies (TSV, hybrid bonding, interposers, etc)
Good verbal and written communication skills with the ability to efficiently synthesize and convey sophisticated technical concepts to other partners and leadership
A self-motivated, hard-working team player who enjoys working with diverse abilities and backgrounds
Having an innovative approach that is open to improving upon any of our processes or products.
Potential Team Member Locations:
Folsom, CA
Atlanta, GA
Allen, TX
The US base salary range that Micron Technology estimates it could pay for this full-time position is: $127,000.00 - $280,000.00
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn more about Micron, please visit micron.com/careers
#J-18808-Ljbffr