Senior Manager, HBM, Product and Solution Planning

Please Note:To provide the best candidate experience with our high application volumes, we limit applications to a total of 10 over 6 months.Advancing the World’s Technology TogetherOur technology solutions power the tools you use every day--including smartphones, electric vehicles, hyperscale data centers, IoT devices, and so much more. Here, you’ll have an opportunity to be part of a global leader whose innovative designs are pushing the boundaries of what’s possible and powering the future.We believe innovation and growth are driven by an inclusive culture and a diverse workforce. We’re dedicated to empowering people to be their true selves. Together, we’re building a better tomorrow for our employees, customers, partners, and communities.What You’ll DoUnderstand memory requirements driven by latest AI applications and accelerators.Identify key technical elements (design/architecture/package, test and assembly) necessary for defining and productizing leading-edge HBM products.Communicate a product vision clearly to team members and key partners and inspire actions that lead to solid product definitions.Communicate constantly and clearly with key partners and customers to adapt to evolving product requirements.Derive key spec, features and high-level architecture of HBM products addressing market needs.Develop HBM product plans and roadmap by comprehending internal (senior cross-domain engineers) and external customer feedbacks and requirements.15-20% travel required.What You BringBS in Computer/Electrical Engineering or Computer Science with 15+ years of working experiences in silicon development or MS in Computer/Electrical Engineering or Computer Science with 13+ years of relevant working experience or PhD and 10+ years of relevant working experience preferred.10~15 years of direct work experience in DRAM/SoC design, architecture or product planning.Proven record of productization/commercialization of leading-edge semiconductor products.In-depth technical understanding on DRAM/SoC related protocols & PHYs, such as (not limited to) DDR/HBM(IO), AXI, PCIe/UCIe, etc.Good understanding in process, package and assembly technology & foundry/OSAT ecosystems.Solid/proven communication skill with globally located internal and external customers to comprehend varying requests and address potential issues.Experience in technical (design/architecture) or product planning for HBM, GPGPU or accelerator ASIC.Experience in building product strategy and plan for major memory or SoC manufacturers.Experience in managing full life cycle of leading edge semiconductor products (market research, spec definition, product development and customer engagement).Proven track record in product/program management.MBA/Korean language fluency is a plus.You’re inclusive, adapting your style to the situation and diverse global norms of our people.An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.You’re collaborative, building relationships, humbly offering support and openly welcoming approaches.Innovative and creative, you proactively explore new ideas and adapt quickly to change.Location:

Hybrid, working onsite at our office 3 days per week with the flexibility to work remotely the remainder of your time.Reports to:

SVP

#J-18808-Ljbffr