Northrop Grumman Corp. (JP)
Associate Photolithography Engineer / Photolithography Engineer
Northrop Grumman Corp. (JP), Linthicum, Maryland, United States,
Requisition ID: R10172448
Category:
Engineering
Location:
Linthicum, Maryland, United States of America
Clearance Type:
Secret
Telecommute:
No- Teleworking not available for this position
Shift:
1st Shift (United States of America)
Travel Required:
Yes, 10% of the Time
Relocation Assistance:
Relocation assistance may be available
Positions Available:
1
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history. We look for people who have bold new ideas, courage, and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity, and bringing your whole self to work.
Northrop Grumman Microelectronics Center (NGMC) within Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and creative Photolithography Engineer for our Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland.
Join us for the chance to work with an amazing, experienced, and talented team while helping serve your country. Enjoy the opportunity to grow and learn through a variety of challenging projects in R&D, ongoing long-term programs, and new programs targeting future military platforms.
The Photolithography Engineer should possess some knowledge of lithography principles and practices, as well as entry-level experience in I-line patterning systems, contact lithography, resist spin-coating operations, and adhesive wafer-bonding. Familiarity with a variety of metrology tools including CDSEM and Overlay measurement is also required.
The Photolithography Engineer will be responsible for:
Process qualifications, technician training and certification, and process safety.
Supporting superconducting line including assisting with processing material.
Interfacing with other unit process engineers and product integration engineers to develop processes to support new products.
Writing and maintaining process documentation.
Supporting statistical process control (SPC) and continuous improvement efforts.
Basic Qualifications for Associate Photolithography Engineer:
Bachelor's degree in a related technical discipline with 1 year of relevant experience.
Hands-on knowledge and operation of lithography steppers, direct-write patterning, tracks, CDSEM, and overlay tools.
Experience with semiconductor fabrication.
US Citizenship required.
Must be able to obtain and maintain a Secret clearance.
Basic Qualifications for Photolithography Engineer:
Bachelor's degree in a related technical discipline with 2 years of relevant experience, or 0 years with a Master's degree.
Hands-on knowledge and operation of lithography steppers, adhesive wafer-bonding, resist coat tracks, CDSEM, and overlay tools.
Experience with semiconductor fabrication.
US Citizenship required.
Must be able to obtain and maintain a Secret clearance.
Preferred Qualifications:
Experience working in a compound and Si semiconductor fab as a photolithography engineer.
Strong understanding of semiconductor technology and photolithography principles.
Experience with adhesive wafer-bonding and thermal dismount of bonded wafers.
Experience with coat/develop tracks including C&D P8000, SVG 86xx/88xx, SVG 90S, TEL Mark V, and TEL ACT8 tracks.
Knowledge of resist chemistry and general resist processing, adhesive chemistry.
Data analysis and visualization (JMP and/or MiniTab).
Advanced knowledge of statistical process control (SPC).
Experience in structured problem-solving methodology to troubleshoot tool and process issues.
Ability to work with minimal supervision.
Excellent project management skills with demonstrated ability to identify manufacturing improvements, manage change, and implement solutions.
Ability and desire to assume a technical leadership role within the organization.
Salary Range:
$68,800 - $103,200
Salary Range 2:
$83,300 - $124,900
Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
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Category:
Engineering
Location:
Linthicum, Maryland, United States of America
Clearance Type:
Secret
Telecommute:
No- Teleworking not available for this position
Shift:
1st Shift (United States of America)
Travel Required:
Yes, 10% of the Time
Relocation Assistance:
Relocation assistance may be available
Positions Available:
1
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history. We look for people who have bold new ideas, courage, and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity, and bringing your whole self to work.
Northrop Grumman Microelectronics Center (NGMC) within Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and creative Photolithography Engineer for our Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland.
Join us for the chance to work with an amazing, experienced, and talented team while helping serve your country. Enjoy the opportunity to grow and learn through a variety of challenging projects in R&D, ongoing long-term programs, and new programs targeting future military platforms.
The Photolithography Engineer should possess some knowledge of lithography principles and practices, as well as entry-level experience in I-line patterning systems, contact lithography, resist spin-coating operations, and adhesive wafer-bonding. Familiarity with a variety of metrology tools including CDSEM and Overlay measurement is also required.
The Photolithography Engineer will be responsible for:
Process qualifications, technician training and certification, and process safety.
Supporting superconducting line including assisting with processing material.
Interfacing with other unit process engineers and product integration engineers to develop processes to support new products.
Writing and maintaining process documentation.
Supporting statistical process control (SPC) and continuous improvement efforts.
Basic Qualifications for Associate Photolithography Engineer:
Bachelor's degree in a related technical discipline with 1 year of relevant experience.
Hands-on knowledge and operation of lithography steppers, direct-write patterning, tracks, CDSEM, and overlay tools.
Experience with semiconductor fabrication.
US Citizenship required.
Must be able to obtain and maintain a Secret clearance.
Basic Qualifications for Photolithography Engineer:
Bachelor's degree in a related technical discipline with 2 years of relevant experience, or 0 years with a Master's degree.
Hands-on knowledge and operation of lithography steppers, adhesive wafer-bonding, resist coat tracks, CDSEM, and overlay tools.
Experience with semiconductor fabrication.
US Citizenship required.
Must be able to obtain and maintain a Secret clearance.
Preferred Qualifications:
Experience working in a compound and Si semiconductor fab as a photolithography engineer.
Strong understanding of semiconductor technology and photolithography principles.
Experience with adhesive wafer-bonding and thermal dismount of bonded wafers.
Experience with coat/develop tracks including C&D P8000, SVG 86xx/88xx, SVG 90S, TEL Mark V, and TEL ACT8 tracks.
Knowledge of resist chemistry and general resist processing, adhesive chemistry.
Data analysis and visualization (JMP and/or MiniTab).
Advanced knowledge of statistical process control (SPC).
Experience in structured problem-solving methodology to troubleshoot tool and process issues.
Ability to work with minimal supervision.
Excellent project management skills with demonstrated ability to identify manufacturing improvements, manage change, and implement solutions.
Ability and desire to assume a technical leadership role within the organization.
Salary Range:
$68,800 - $103,200
Salary Range 2:
$83,300 - $124,900
Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
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