Northrop Grumman
Principal Physical Vapor Deposition(PVD) Process Engineer / Senior Principal Phy
Northrop Grumman, Linthicum, Maryland, United States,
Requisition ID: R10173725
Category:
Engineering
Location:
Linthicum, Maryland, United States of America
Clearance Type:
Secret
Telecommute:
No - Teleworking not available for this position
Shift:
2nd Shift (United States of America)
Travel Required:
Yes, 10% of the Time
Relocation Assistance:
Relocation assistance may be available
Positions Available:
1
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity, and bringing your whole self to work.
The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and creative
Physical Vapor Deposition (PVD)
Process Engineer
for our Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland.
The
PVD Process Engineer
will be responsible for but not limited to:
All aspects of sustaining PVD processes for semiconductor manufacturing, including process qualifications, technician training and certification, and process safety.
Interfacing with other unit process engineers and product integration engineers to develop processes to support emerging technologies.
Supporting statistical process control (SPC) and continuous improvement efforts.
Establishing standard operating procedures and engaging the operations team to ensure these are followed.
Training technicians and maintaining process documentation.
Performing all other related duties as assigned.
The 2nd shift is Monday-Friday, 2:00PM-11:00PM. Rare on-call duties outside of assigned work schedule, however, options for extended work hours are potentially available.
Basic Qualifications for Principal Physical Vapor Deposition (PVD) Process Engineer:
Bachelors in Electrical Engineering, Chemical Engineering, Materials Engineering, Mechanical Engineering, Chemistry, Physics or closely related discipline with 5 years technical related experience in semiconductor fabrication; or a Masters Degree with 3 years’ experience; or a PhD with 0 years experience.
Good understanding/knowledge of physical vapor deposition (PVD) processes.
Direct experience with semiconductor fabrication and working in a cleanroom environment.
Good interpersonal and communication skills, both written and verbal, and problem-solving skills.
Ability to work in a Class 100 cleanroom environment and meet all physical and PPE requirements.
Ability to obtain and maintain a Secret clearance.
Must be a US citizen.
Must be able to work 2nd shift (Monday-Friday, 2:00PM-11:00PM).
Basic Qualifications for Senior Principal Physical Vapor Deposition (PVD) Process Engineer:
Bachelors in Electrical Engineering, Chemical Engineering, Materials Engineering, Mechanical Engineering, Chemistry, Physics or closely related discipline with 8 years technical related experience in semiconductor fabrication; or a Masters degree with 6 years of experience; or a PhD with 3 years of experience.
Good understanding/knowledge of physical vapor deposition (PVD) processes.
Direct experience with semiconductor fabrication and working in a cleanroom environment.
Good interpersonal and communication skills, both written and verbal, and problem-solving skills.
Ability to work in a Class 100 cleanroom environment and meet all physical and PPE requirements.
Ability to obtain and maintain a Secret clearance.
Must be a US citizen.
Must be able to work 2nd shift (Monday-Friday, 2:00PM-11:00PM).
Preferred Qualifications:
Hands-on experience with sputtering equipment from OEMs like Evatec, Angstrom Engineering, Applied Materials, Inc. (AMAT).
Experience in superconductor microelectronics.
Experience in lean manufacturing practices and structured problem-solving methodology, DOEs.
Familiar with various software packages commonly found in Semiconductor Wafer Fabs – EMS Systems (FactoryWorks or alike systems), statistical analysis tools – SPACE, JMP, Minitab, etc.
Active Secret clearance.
Salary Range:
$102,400 - $153,600Salary Range 2:
$127,000 - $190,600
Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer.
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Category:
Engineering
Location:
Linthicum, Maryland, United States of America
Clearance Type:
Secret
Telecommute:
No - Teleworking not available for this position
Shift:
2nd Shift (United States of America)
Travel Required:
Yes, 10% of the Time
Relocation Assistance:
Relocation assistance may be available
Positions Available:
1
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity, and bringing your whole self to work.
The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and creative
Physical Vapor Deposition (PVD)
Process Engineer
for our Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland.
The
PVD Process Engineer
will be responsible for but not limited to:
All aspects of sustaining PVD processes for semiconductor manufacturing, including process qualifications, technician training and certification, and process safety.
Interfacing with other unit process engineers and product integration engineers to develop processes to support emerging technologies.
Supporting statistical process control (SPC) and continuous improvement efforts.
Establishing standard operating procedures and engaging the operations team to ensure these are followed.
Training technicians and maintaining process documentation.
Performing all other related duties as assigned.
The 2nd shift is Monday-Friday, 2:00PM-11:00PM. Rare on-call duties outside of assigned work schedule, however, options for extended work hours are potentially available.
Basic Qualifications for Principal Physical Vapor Deposition (PVD) Process Engineer:
Bachelors in Electrical Engineering, Chemical Engineering, Materials Engineering, Mechanical Engineering, Chemistry, Physics or closely related discipline with 5 years technical related experience in semiconductor fabrication; or a Masters Degree with 3 years’ experience; or a PhD with 0 years experience.
Good understanding/knowledge of physical vapor deposition (PVD) processes.
Direct experience with semiconductor fabrication and working in a cleanroom environment.
Good interpersonal and communication skills, both written and verbal, and problem-solving skills.
Ability to work in a Class 100 cleanroom environment and meet all physical and PPE requirements.
Ability to obtain and maintain a Secret clearance.
Must be a US citizen.
Must be able to work 2nd shift (Monday-Friday, 2:00PM-11:00PM).
Basic Qualifications for Senior Principal Physical Vapor Deposition (PVD) Process Engineer:
Bachelors in Electrical Engineering, Chemical Engineering, Materials Engineering, Mechanical Engineering, Chemistry, Physics or closely related discipline with 8 years technical related experience in semiconductor fabrication; or a Masters degree with 6 years of experience; or a PhD with 3 years of experience.
Good understanding/knowledge of physical vapor deposition (PVD) processes.
Direct experience with semiconductor fabrication and working in a cleanroom environment.
Good interpersonal and communication skills, both written and verbal, and problem-solving skills.
Ability to work in a Class 100 cleanroom environment and meet all physical and PPE requirements.
Ability to obtain and maintain a Secret clearance.
Must be a US citizen.
Must be able to work 2nd shift (Monday-Friday, 2:00PM-11:00PM).
Preferred Qualifications:
Hands-on experience with sputtering equipment from OEMs like Evatec, Angstrom Engineering, Applied Materials, Inc. (AMAT).
Experience in superconductor microelectronics.
Experience in lean manufacturing practices and structured problem-solving methodology, DOEs.
Familiar with various software packages commonly found in Semiconductor Wafer Fabs – EMS Systems (FactoryWorks or alike systems), statistical analysis tools – SPACE, JMP, Minitab, etc.
Active Secret clearance.
Salary Range:
$102,400 - $153,600Salary Range 2:
$127,000 - $190,600
Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer.
#J-18808-Ljbffr