Logo
Harris Geospatial Solutions

Printed Circuit Board Subject Matter Expert (1st shift) (9/80)

Harris Geospatial Solutions, Palm Bay, Florida, United States, 32905


Job Title: Printed Circuit Board Subject Matter Expert (1st shift) (9/80)Job Code: 15868Job Location:

Palm Bay, FLJob Description:The person filling this position will support a cross-functional team, overseeing the design and review of Printed-Circuit-Board designs prior to release to the board shop. The role involves interfacing with a broad range of Electrical, Mechanical, and Manufacturing engineering disciplines during design, fabrication, and production floor activities. Responsibilities include design review meetings, drawing and artwork reviews, attending design and status meetings, peer reviews, and production support. A good understanding of complex HDI designs, lamination, and micro-via structures is essential. The role will also require some travel time for auditing board shops that manufacture products used within L3Harris products.Essential Functions:The engineer will work closely with a cross-functional team to ensure hardware producibility and manufacturability build strategies.Attend, participate in, and support detailed engineering design review meetings as required.Provide advanced technical support during the design phase and related to manufacturing activities of the PCB.Identify critical-to-yield process parameters and specifications throughout the design review prior to drawing release and downstream manufacture.Understand Printed Circuit Board manufacturing and design applications.Support teams in resolving manufacturing production yields, quality, and reliability issues related to PCB matters.Willingness to travel as required for on-site supplier quality audits, assessments, and inspections of PCB manufacturers.Conduct facility process audits and support PCB suppliers in manufacturing and quality issues related to HDI PCB manufacturing.Qualifications:Bachelor’s Degree and a minimum of 9 years of prior relevant experience, or a Graduate Degree with a minimum of 7 years of prior related experience. In lieu of a degree, a minimum of 13 years of prior related experience is required.Preferred Additional Skills:Working knowledge of IPC/J-STD workmanship requirements, specifically IPC-A600, IPC-6012/6013, MIL-Spec-55110, and MIL-Spec-31032.Deep knowledge of common PCB electronic packaging details including surface finishes, plating, lamination, and stack-up best practices.Experience with interconnect conductivity vs thickness and operating frequencies dielectric choices.Knowledge of Micro-Via Processes and ability to read micro-sections.Knowledge of PCB material finishes and types, specifically pre-preg core different material types.Understanding of PCB manufacturing processes, common defects, problems, and their impact on product reliability.Knowledge of bare PCB manufacturers’ capabilities, constraints, and performance vs lifecycle cost.Hands-on experience in manufacturing electronics for high-reliability military and government systems is preferred.Knowledge of root cause and corrective action analysis tools for manufacturing process problems, workmanship defects, and mechanical test failures.Excellence in solving problems as they occur and recommending and implementing improvements related to production processes.Ability to manage resources and multiple priorities while interacting with individuals at all levels within the organization and customers as required.Proficiency in Microsoft Excel, PowerPoint, and Word.

#J-18808-Ljbffr