Logo
IBM

Infrastructure & Technology Hardware Engineer - Semiconductor Intern: 2025 Multi

IBM, Cambridge, Massachusetts, us, 02140


IntroductionIBM Research is seeking intern candidates who want to apply their classroom learning to real-world challenges. As a Hardware Engineer Intern in semiconductor research, you will work with world-class global researchers focused on enabling next-generation chips and systems that support the tremendous processing power and unprecedented speeds required for next-generation logic/memory technology and support applications such as hybrid cloud and artificial intelligence.

Your Role and ResponsibilitiesThis is for a 2025 summer internship with the following start dates: May - August or June - September for quarter system schools. In this role, you will investigate the feasibility of applying science and engineering principles towards innovative, new hardware design and applications from state-of-the-art chip architecture, design, fabrication, and test to advanced chip packaging. Background knowledge of engineering disciplines, computer science, physics, or materials science are ideal skills for this role. Interns are expected to have the ability to analyze complex problems and apply creative solutions to groundbreaking hardware engineering projects.

Required Technical and Professional ExpertiseCandidate should be pursuing a Bachelor's Degree.Electrical EngineeringMechanical EngineeringComputer ScienceMaterials EngineeringPhysics/Chemistry

Preferred Technical and Professional ExpertiseSemiconductor fabrication knowledgeCoursework

#J-18808-Ljbffr