Headway Technologies
Photolithography Process Engineer
Headway Technologies, Milpitas, California, United States, 95035
TITLE: PHOTOLITHOGRAPHY PROCESS DEVELOPMENT ENGINEER
FLSA STATUS: EXEMPT
REPORTS TO: DIRECTOR, PHOTOLITHOGRAPY PROCESS ENGINEERING
SUMMARY:Under the direction of the Director of Photolithography Process Engineering, the Photolithography Process Development Engineer is responsible for the developing and implementing new photolithography processes for next generation magnetic recording heads, including implementing new photolithography processes which ensure product manufacturability; designs and conducts experiments, analyzes data, and presents findings; researches, selects, and qualifies new tools which improve efficiency and yield. This position is located in Milpitas, California.
ESSENTIAL FUNCTIONS:Develops and implements new photolithography processes for next generation magnetic recording headsImplements new process control schemes or methodologies which ensure product manufacturabilityDesigns and conducts experiments, analyzes data, and develops recommendations for improving performance and yield while reducing scrapAdheres to appropriate timeline for introducing new processes into the manufacturing linePartners with other groups and departments, including process and product engineering to develop and deliver products and programsOversees the work of the Process Technicians to ensure accurate process execution and efficient wafer dispositionAdheres to all safety policies and procedures as requiredPerforms other duties of a similar nature or level*
MINIMUM QUALIFICATIONS:Bachelor’s degree in Materials Science, Physics, or Electrical Engineering and/or equivalent relevant experience; PhD preferredOne to three years of experience working in the magnetic recording head, hard disk drive, or semiconductor industry in Process DevelopmentExperience working in a wafer fab manufacturing environmentExperience with Statistical Process Control (SPC)Proficient in the use of Microsoft Office Applications
Knowledge, Skills, and Abilities:Knowledge of semiconductor or HDD industry principles, practices, and techniquesKnowledge of wafer fabrication processing techniques, including process development and integration practicesKnowledge of TMR and PMR processes and applicationsKnowledge of wafer manufacturing principles, processes, and equipmentKnowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentationsKnowledge and ability to use Statistical Process Control (SPC) to analyze data, create reports, present findings, and recommend appropriate actionAble to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and managementAble to work productively and collaboratively with all levels of employees and managementAble to comply with all safety policies and proceduresDemonstrated organizational and time management skillsDemonstrated problem-solving and trouble shooting skillsFlexible and able to prioritize
The annual base salary for this full-time position is between $96,655.00-$142,140.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.
WORKING CONDITIONS:The Photolithography Process/Manufacturing Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from site-to-site as needed. May also work in a class 100 ESD sensitive wafer fab manufacturing facility; adheres to required safety and dress standards. May be exposed to hazardous chemicals, fumes, or vapors and excessive noise from time-to-time while in the wafer manufacturing facility; stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 pounds.
*Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Departm
FLSA STATUS: EXEMPT
REPORTS TO: DIRECTOR, PHOTOLITHOGRAPY PROCESS ENGINEERING
SUMMARY:Under the direction of the Director of Photolithography Process Engineering, the Photolithography Process Development Engineer is responsible for the developing and implementing new photolithography processes for next generation magnetic recording heads, including implementing new photolithography processes which ensure product manufacturability; designs and conducts experiments, analyzes data, and presents findings; researches, selects, and qualifies new tools which improve efficiency and yield. This position is located in Milpitas, California.
ESSENTIAL FUNCTIONS:Develops and implements new photolithography processes for next generation magnetic recording headsImplements new process control schemes or methodologies which ensure product manufacturabilityDesigns and conducts experiments, analyzes data, and develops recommendations for improving performance and yield while reducing scrapAdheres to appropriate timeline for introducing new processes into the manufacturing linePartners with other groups and departments, including process and product engineering to develop and deliver products and programsOversees the work of the Process Technicians to ensure accurate process execution and efficient wafer dispositionAdheres to all safety policies and procedures as requiredPerforms other duties of a similar nature or level*
MINIMUM QUALIFICATIONS:Bachelor’s degree in Materials Science, Physics, or Electrical Engineering and/or equivalent relevant experience; PhD preferredOne to three years of experience working in the magnetic recording head, hard disk drive, or semiconductor industry in Process DevelopmentExperience working in a wafer fab manufacturing environmentExperience with Statistical Process Control (SPC)Proficient in the use of Microsoft Office Applications
Knowledge, Skills, and Abilities:Knowledge of semiconductor or HDD industry principles, practices, and techniquesKnowledge of wafer fabrication processing techniques, including process development and integration practicesKnowledge of TMR and PMR processes and applicationsKnowledge of wafer manufacturing principles, processes, and equipmentKnowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentationsKnowledge and ability to use Statistical Process Control (SPC) to analyze data, create reports, present findings, and recommend appropriate actionAble to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and managementAble to work productively and collaboratively with all levels of employees and managementAble to comply with all safety policies and proceduresDemonstrated organizational and time management skillsDemonstrated problem-solving and trouble shooting skillsFlexible and able to prioritize
The annual base salary for this full-time position is between $96,655.00-$142,140.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.
WORKING CONDITIONS:The Photolithography Process/Manufacturing Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from site-to-site as needed. May also work in a class 100 ESD sensitive wafer fab manufacturing facility; adheres to required safety and dress standards. May be exposed to hazardous chemicals, fumes, or vapors and excessive noise from time-to-time while in the wafer manufacturing facility; stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 pounds.
*Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Departm