SK Hynix
System in Package Technologies (Sr. Manager)
SK Hynix, San Jose, California, United States, 95199
Job Title: System in Package Technologies Sr. Manager
Office Location: San Jose, CAWork Model: OnsiteAt SK hynix America , we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape.We're looking for innovative minds to join our mission of shaping the future of technology. At SK hynix America, you'll be part of a team that's pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing.Responsibilities:
Development of advance packaging technologies for 2.5D/3D heterogeneous integration with High Bandwidth Memory (HBM)Perform design and what if scenario analysis for novel advanced packaging schemes to improve system in package (SIP) performanceCollaborate with internal and external stakeholders to ensure seamless advanced packaging technology developmentIdentify and evaluate novel ideas and technologies with potential for future applicationsMinimum Qualifications:
BS in Materials Science, Mechanical Engineering or equivalent industry experience5+ years of experiences in advanced packaging technology development and manufacturingIn-depth knowledge in 2.5D/3D packaging technologies and large body substrate technologiesEffective communication skillsExperience working effectively with cross-functional teamsPreferred Qualifications:
Master Degree or PhD in Materials Science, Mechanical Engineering or equivalent industry experience7+ years of experiences in advanced packaging technology development and manufacturingIn-depth knowledge in 2.5D/3D packaging technologies and large body substrate technologiesProven technical understanding of advanced packaging materials, their interactions, failure mechanisms and analytical techniquesEffective communication skillsTotal Rewards:
Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. The U.S. pay range for this position is base $185,000 - $232,000. Pay within this range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process.Our benefits include:Top Tier health insurance at no employee costPaid day offs: PTO + Company Holidays + Happy FridaysPaid Parental Leave Program401k MatchingEducational reimbursement up to $10,000 per yearDonation Matching and volunteering opportunitiesCorporate discount programsFree Breakfast/Lunch/Dinner provided to employeesEqual Employment Opportunity:
SKHYA is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information or any other status protected under federal, state, or local applicable laws.
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Office Location: San Jose, CAWork Model: OnsiteAt SK hynix America , we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape.We're looking for innovative minds to join our mission of shaping the future of technology. At SK hynix America, you'll be part of a team that's pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing.Responsibilities:
Development of advance packaging technologies for 2.5D/3D heterogeneous integration with High Bandwidth Memory (HBM)Perform design and what if scenario analysis for novel advanced packaging schemes to improve system in package (SIP) performanceCollaborate with internal and external stakeholders to ensure seamless advanced packaging technology developmentIdentify and evaluate novel ideas and technologies with potential for future applicationsMinimum Qualifications:
BS in Materials Science, Mechanical Engineering or equivalent industry experience5+ years of experiences in advanced packaging technology development and manufacturingIn-depth knowledge in 2.5D/3D packaging technologies and large body substrate technologiesEffective communication skillsExperience working effectively with cross-functional teamsPreferred Qualifications:
Master Degree or PhD in Materials Science, Mechanical Engineering or equivalent industry experience7+ years of experiences in advanced packaging technology development and manufacturingIn-depth knowledge in 2.5D/3D packaging technologies and large body substrate technologiesProven technical understanding of advanced packaging materials, their interactions, failure mechanisms and analytical techniquesEffective communication skillsTotal Rewards:
Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. The U.S. pay range for this position is base $185,000 - $232,000. Pay within this range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process.Our benefits include:Top Tier health insurance at no employee costPaid day offs: PTO + Company Holidays + Happy FridaysPaid Parental Leave Program401k MatchingEducational reimbursement up to $10,000 per yearDonation Matching and volunteering opportunitiesCorporate discount programsFree Breakfast/Lunch/Dinner provided to employeesEqual Employment Opportunity:
SKHYA is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information or any other status protected under federal, state, or local applicable laws.
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