CV Library
Sr Specialist, Mechanical Engineer (Electronics Packaging)
CV Library, Santa Monica, California, United States, 90403
Job Title:
Senior Specialist, Mechanical Engineer (Electronics Packaging)Job Code:
15460Job Location:
Van Nuys, CARelocation:
Relocation assistance is available for qualified candidates!Job Description:
Seeking an Electronic Packaging / Mechanical Engineer to work with a cross-functional team to develop and integrate Electronic Packaging systems with ground up designs as well as COTS components/assemblies, following the product from conceptualization through hardware integration and testing. The position will require performing the mechanical engineering activities related to the design, analysis, documentation, processing, fabrication, assembly and qualification of product to the specification requirements with technical, schedule, and process requirements. Provide legacy design production engineering support to address root cause and corrective action evaluation and make recommended design updates as requirements change to ensure the product maintains production schedule.Essential Functions:
Support the design and development of complex mechanical, electronic packaging and electro-mechanical designs and execute layouts for multiple large scale radar products.Develop solutions for packaging of electrical components including COTS components and assemblies, Circuit Cards, Connectors, and cables, including design, integration and validation in rugged environments. Responsible for following standard MEP design practices including relevant internal and program design reviews prior to the release of the design in the product data management tool.Work closely with cross-functional teams including Designers, Thermal/Structural Analysts, Systems Engineers, as well as other engineering disciplines as well as Operations, Procurement, Quality, Program Managers, and customer counterparts in the development of new designs and releasing to production.Perform and guide analyses including thermal analysis of large cooling systems down to the printed circuit assembly level, as well as fluid, structural (static, vibration and shock), and power.Responsible for developing, integrating, and validating new designs including prototyping, testing, and troubleshooting of the new products as they are released for full scale production. This will also include the development and implementation of test protocols for both informal and formal design testing as well as the support of manufacturing work instruction documentation as needed by the Production manufacturing engineering team.Support proposal technical content for bids: scope capture, requirements development, materials pricing, and labor estimates as required.May lead, train, and mentor junior engineers.Qualifications:
Bachelor’s Degree in Mechanical Engineering and minimum 6 years of prior relevant experience or a Graduate Degree (MS/PhD) and a minimum of 4 years of prior related experience. In lieu of a degree, minimum of 12 years of prior related experience.4+ years experience in solving electronic packaging trades involving Printed Board assembly (PCB) and Circuit Card Assembly (CCA) designs under environmental conditions.Experience with MIL Standards including but not limited to 810, 461 as well as material, plating and electronics packaging assembly MIL standards.CAD experience utilizing PTC CREO/Windchill.Structural analysis experience in ANSYS.Experience with and understanding of standard ASME Y14.5M-1994 and GD&T.Ability to obtain and maintain a security clearance.Additional Skills:
Experience with large radar motor and transmission systems.Experience with integration of COTS components/assemblies in a lead system integrator role.Experience with machined, plastic and sheet metal part design.Design for Manufacturability and Assembly (DFM/DFMA) experience.Experience with PDM.Experience with Earned Value Management cost and schedule practices.Experience with Project Management. A wide degree of creativity and latitude is expected, including the ability to multi-task in an environment with changing priorities.Proficiency in MS Office suite.Effectively communicate issues/problems and results that impact timelines, accuracy, and reliability of project data.In compliance with pay transparency requirements, the salary range for this role is $97,500.00 - $(phone number removed). This is not a guarantee of compensation or salary, as final offer amount may vary based on factors including but not limited to experience and geographic location. L3Harris also offers a variety of benefits, including health and insurance, 401(k) match, flexible spending accounts, EAP, education assistance, parental leave, paid time off, and company-paid holidays. The specific programs and options available to an employee may vary depending on date of hire, schedule type, and the applicability of collective bargaining agreements. Qualified applications with arrest or conviction records will be considered for employment in accordance with Los Angeles County Fair Chance Ordinance for Employers and the California Fair Chance Act.
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Senior Specialist, Mechanical Engineer (Electronics Packaging)Job Code:
15460Job Location:
Van Nuys, CARelocation:
Relocation assistance is available for qualified candidates!Job Description:
Seeking an Electronic Packaging / Mechanical Engineer to work with a cross-functional team to develop and integrate Electronic Packaging systems with ground up designs as well as COTS components/assemblies, following the product from conceptualization through hardware integration and testing. The position will require performing the mechanical engineering activities related to the design, analysis, documentation, processing, fabrication, assembly and qualification of product to the specification requirements with technical, schedule, and process requirements. Provide legacy design production engineering support to address root cause and corrective action evaluation and make recommended design updates as requirements change to ensure the product maintains production schedule.Essential Functions:
Support the design and development of complex mechanical, electronic packaging and electro-mechanical designs and execute layouts for multiple large scale radar products.Develop solutions for packaging of electrical components including COTS components and assemblies, Circuit Cards, Connectors, and cables, including design, integration and validation in rugged environments. Responsible for following standard MEP design practices including relevant internal and program design reviews prior to the release of the design in the product data management tool.Work closely with cross-functional teams including Designers, Thermal/Structural Analysts, Systems Engineers, as well as other engineering disciplines as well as Operations, Procurement, Quality, Program Managers, and customer counterparts in the development of new designs and releasing to production.Perform and guide analyses including thermal analysis of large cooling systems down to the printed circuit assembly level, as well as fluid, structural (static, vibration and shock), and power.Responsible for developing, integrating, and validating new designs including prototyping, testing, and troubleshooting of the new products as they are released for full scale production. This will also include the development and implementation of test protocols for both informal and formal design testing as well as the support of manufacturing work instruction documentation as needed by the Production manufacturing engineering team.Support proposal technical content for bids: scope capture, requirements development, materials pricing, and labor estimates as required.May lead, train, and mentor junior engineers.Qualifications:
Bachelor’s Degree in Mechanical Engineering and minimum 6 years of prior relevant experience or a Graduate Degree (MS/PhD) and a minimum of 4 years of prior related experience. In lieu of a degree, minimum of 12 years of prior related experience.4+ years experience in solving electronic packaging trades involving Printed Board assembly (PCB) and Circuit Card Assembly (CCA) designs under environmental conditions.Experience with MIL Standards including but not limited to 810, 461 as well as material, plating and electronics packaging assembly MIL standards.CAD experience utilizing PTC CREO/Windchill.Structural analysis experience in ANSYS.Experience with and understanding of standard ASME Y14.5M-1994 and GD&T.Ability to obtain and maintain a security clearance.Additional Skills:
Experience with large radar motor and transmission systems.Experience with integration of COTS components/assemblies in a lead system integrator role.Experience with machined, plastic and sheet metal part design.Design for Manufacturability and Assembly (DFM/DFMA) experience.Experience with PDM.Experience with Earned Value Management cost and schedule practices.Experience with Project Management. A wide degree of creativity and latitude is expected, including the ability to multi-task in an environment with changing priorities.Proficiency in MS Office suite.Effectively communicate issues/problems and results that impact timelines, accuracy, and reliability of project data.In compliance with pay transparency requirements, the salary range for this role is $97,500.00 - $(phone number removed). This is not a guarantee of compensation or salary, as final offer amount may vary based on factors including but not limited to experience and geographic location. L3Harris also offers a variety of benefits, including health and insurance, 401(k) match, flexible spending accounts, EAP, education assistance, parental leave, paid time off, and company-paid holidays. The specific programs and options available to an employee may vary depending on date of hire, schedule type, and the applicability of collective bargaining agreements. Qualified applications with arrest or conviction records will be considered for employment in accordance with Los Angeles County Fair Chance Ordinance for Employers and the California Fair Chance Act.
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