Senior Electro-Optic Packaging Engineer

We believe quantum computing will change everything.  It will have the power to transform the foundations of giant industries that rely on intensive computation.  PsiQuantum is on a mission to build the world’s first useful quantum computer, capable of delivering these transformative results.  We know that means it will need 1 million qubits, error correction, a scalable architecture and a data center footprint.By harnessing the laws of quantum physics, quantum computers can provide exponential performance increases over today’s most powerful supercomputers, offering the potential for extraordinary advances across a broad range of industries including climate, energy, healthcare, pharmaceuticals, finance, agriculture, transportation, materials design, and many more. PsiQuantum is uniquely positioned to deliver on the promise of quantum computing years earlier than our competitors. Our architecture is based on photonics which gives us the ability to produce our components using existing high-volume semiconductor manufacturing processes, the same processes that are today producing billions of chips for telecom and consumer electronics applications. Since photons don’t feel heat, we can take advantage of existing cryogenic cooling systems, the kind that have been operating at facilities like the Stanford Linear Accelerator (SLAC).  And because photons are in fact light, they can move between subsystems at tremendous speed using standard fiber connectivity.Our team is building a utility scale quantum computer and the software tools needed to build fault tolerant quantum applications. We’re a highly motivated and collaborative group focused on a singular goal - building the world’s first useful quantum computer on the fastest path possible. There’s much more work to be done and we are looking for exceptional talent to join us on this extraordinary journey! Job Summary: The Senior Electro-Optic Packaging Engineer will lead the design and development of advanced electro-optical packages, ensuring seamless integration across system teams, PIC/IC design teams, foundry engineering, PCB design teams, assembly process engineering, and packaging teams (optical and EIC). This role involves establishing electro-optical packaging design rules, conducting DFMEAs, executing risk mitigation plans, and coordinating both numerical and experimental validations to ensure designs meet performance and manufacturability requirements. The engineer will drive collaboration, align stakeholders through design reviews, and manage expectations across cross-functional teams.Responsibilities:Collaborate with PIC/silicon design and system teams to recommend optimal package solutions that meet electrical, mechanical, thermal, optical, and system-level requirements.Drive the design of electro-optical subassembly packages, including material selection, BOM optimization, body sizing, manufacturability considerations, and package architecture to meet DFM standards.Develop and maintain a library of design rules based on performance requirements, PIC/IC keep-out zones, and assembly process constraints.Conduct DFMEA, identify potential failure modes, and implement effective risk mitigation plans.Validate package designs through numerical simulations and experimental methods to ensure alignment with system requirements.Organize and lead package design reviews to secure alignment from stakeholders.Collaborate with internal assembly process experts and external partners to transition electro-optical packaging solutions from concept through prototyping to mass production.Experience/Qualifications:Proficiency with mechanical design tools (e.g., SolidWorks), package design tools, schematic capture tools, and circuit design tools.Familiarity with thermo-mechanical and electrical simulation tools.Familiarity with package assembly processes, including die attach (TCB, C4, DAF), wire bonding, surface mount technology, optical coupling, underfilling, fiber attachment, substrate technologies, BOM selection, and testing.Engineering degree in Mechanical, Electrical, Materials Science, Microelectronics, Computing Architecture, Physics, or related fields (BSc with 6+ years of experience, MSc with 3+ years, or a PhD).PsiQuantum provides equal employment opportunity for all applicants and employees. PsiQuantum does not unlawfully discriminate on the basis of race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, gender expression, national origin, ancestry, citizenship, age, physical or mental disability, military or veteran status, marital status, domestic partner status, sexual orientation, genetic information, or any other basis protected by applicable laws.Note: PsiQuantum will only reach out to you using an official PsiQuantum email address and will never ask you for bank account information as part of the interview process. Please report any suspicious activity to recruiting@psiquantum.com.We are not accepting unsolicited resumes from employment agencies.The range below reflects the minimum and maximum target range for new hire base salary across all US locations. Actual compensation may vary outside of this range and is dependent on various factors including but not limited to a candidate's qualifications including relevant education and training, competencies, experience, geographic location, and business needs. Base pay is only one part of the total compensation package. Full time roles are eligible for equity and benefits. Base pay is subject to change and may be modified in the future.For a fully qualified candidate, the expected base pay range is: Base Pay Range $150,000—$200,000 USD