Senior Electro-Optic Assembly Process Engineer

We believe quantum computing will change everything.  It will have the power to transform the foundations of giant industries that rely on intensive computation.  PsiQuantum is on a mission to build the world’s first useful quantum computer, capable of delivering these transformative results.  We know that means it will need 1 million qubits, error correction, a scalable architecture and a data center footprint.By harnessing the laws of quantum physics, quantum computers can provide exponential performance increases over today’s most powerful supercomputers, offering the potential for extraordinary advances across a broad range of industries including climate, energy, healthcare, pharmaceuticals, finance, agriculture, transportation, materials design, and many more. PsiQuantum is uniquely positioned to deliver on the promise of quantum computing years earlier than our competitors. Our architecture is based on photonics which gives us the ability to produce our components using existing high-volume semiconductor manufacturing processes, the same processes that are today producing billions of chips for telecom and consumer electronics applications. Since photons don’t feel heat, we can take advantage of existing cryogenic cooling systems, the kind that have been operating at facilities like the Stanford Linear Accelerator (SLAC).  And because photons are in fact light, they can move between subsystems at tremendous speed using standard fiber connectivity.Our team is building a utility scale quantum computer and the software tools needed to build fault tolerant quantum applications. We’re a highly motivated and collaborative group focused on a singular goal - building the world’s first useful quantum computer on the fastest path possible. There’s much more work to be done and we are looking for exceptional talent to join us on this extraordinary journey! Job Summary: The Electro-Optic Assembly Process Engineer will lead the development and optimization of assembly processes for advanced electro-optic packages. This role involves close collaboration with electro-optic package design, optical packaging, and EIC packaging teams to ensure manufacturability (DFM) and compliance with assembly process design rules. The engineer will develop and characterize assembly processes, create work instructions, and monitor process capability and stability. Key areas of focus include establishing defect libraries, conducting PFMEAs, implementing risk mitigation plans, and enhancing design flexibility through process design rule improvements.The engineer will also assess the impact of assembly processes on PIC/EIC performance, infuence BOM selection, optimize material handling, and design fixturing tools to support complex subassemblies. This position requires collaboration with operations teams to define and select process equipment, create related process recipes, and train engineers and technicians. Additionally, the role involves driving root cause analysis for yield losses or failures in manufacturing, qualification, or field operations, and implementing continuous improvement activities to meet production and quality goals.Responsibilities:Design, develop, and optimize assembly processes for electro-optic packages, ensuring DFM and adherence to design rules.Collaborate with internal teams and external OSATs to enhance assembly process capabilities and flexibility.Prepare detailed work instructions, perform process characterization, and define success criteria for assembly processes.Establish and maintain a defect library, defining specifications to mitigate assembly-related failures.Conduct PFMEA, identify key risks, and implement effective mitigation strategies.Develop and deploy process monitoring methodologies, including measurement capability analysis.Characterize the impact of assembly processes on PIC/EIC performance and optimize processes to enhance system reliability and yield.Influence design and BOM selection decisions based on process capabilities and reliability expectations.Coordinate material handling and fixturing tool designs to support complex subassembly assembly processes.Collaborate with operations and OSATs to align process improvements with production requirements.Partner with operations teams to define process equipment requirements, support selection and acquisition, and create process recipes.Train operations engineers and technicians to ensure smooth process transfer and readiness for production.Drive root cause analysis for yield loss and failures during manufacturing, qualification, or field use.Own and execute continuous improvement activities to enhance process performance, stability, and yield.Experience/Qualifications:Hands-on experience with assembly processes such as die attach, wire bonding, optical coupling, underfill, fiber attachment, substrate handling, and advanced material handling.Proficiency in process characterization, process monitoring, and statistical process control (SPC) and metrology development, including measurement capability analysis techniques.Strong knowledge of PFMEA and risk mitigation methodologies.Familiarity with the interaction between assembly processes and PIC/EIC performance.Experience designing fixtures and handling tools for complex subassemblies.Strong skills in equipment specification, selection, and recipe development for assembly processes.Proven ability to lead root cause analysis and implement corrective actions for yield and quality improvements.Bachelor’s degree in Mechanical, Materials, Electrical Engineering, or a related field with 6+ years of experience; Master’s degree with 3+ years; or a Ph.D.PsiQuantum provides equal employment opportunity for all applicants and employees. PsiQuantum does not unlawfully discriminate on the basis of race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, gender expression, national origin, ancestry, citizenship, age, physical or mental disability, military or veteran status, marital status, domestic partner status, sexual orientation, genetic information, or any other basis protected by applicable laws.Note: PsiQuantum will only reach out to you using an official PsiQuantum email address and will never ask you for bank account information as part of the interview process. Please report any suspicious activity to recruiting@psiquantum.com.We are not accepting unsolicited resumes from employment agencies.The range below reflects the minimum and maximum target range for new hire base salary across all US locations. Actual compensation may vary outside of this range and is dependent on various factors including but not limited to a candidate's qualifications including relevant education and training, competencies, experience, geographic location, and business needs. Base pay is only one part of the total compensation package. Full time roles are eligible for equity and benefits. Base pay is subject to change and may be modified in the future.For a fully qualified candidate, the expected base pay range is: Base Pay Range $150,000—$200,000 USD