itechstack
Senior PCB eCAD Design Engineer
itechstack, New Freedom, Pennsylvania, United States, 17349
Job Title: Senior PCB eCAD Design Engineer
Read on to fully understand what this job requires in terms of skills and experience If you are a good match, make an application. Location: New Freedom, PA Duration: Full time/Contract
Job Description & Skill Requirement: Experience: PCB layout Designing of Analog, Digital & Mixed signal PCB’s 7+ years in PCB eCAD Multilayer PCB Layout designing. PCB EDA tool Mentor Graphics Xpedition (Mandatory) Other tools knowledge will be added advantage (Altium, Cadence). Library development & Validation.
Primary Skills: PCB Layout process flow, Library development and validation; Schematic capture; Part Placement; Constraints setting Electrical/DFA/DFM; Power split plan; Routing; Controlled impedance Length tuning & Post Gerber process.
Roles & Responsibilities: Designing of compact, high density, and high component count PCB layouts. Expertise in analyzing PCB feasibility – Layers / PCB size optimization activities. Closely interact with cross functional teams (HW, Mechanical, SI-PI & FAB house)
Read on to fully understand what this job requires in terms of skills and experience If you are a good match, make an application. Location: New Freedom, PA Duration: Full time/Contract
Job Description & Skill Requirement: Experience: PCB layout Designing of Analog, Digital & Mixed signal PCB’s 7+ years in PCB eCAD Multilayer PCB Layout designing. PCB EDA tool Mentor Graphics Xpedition (Mandatory) Other tools knowledge will be added advantage (Altium, Cadence). Library development & Validation.
Primary Skills: PCB Layout process flow, Library development and validation; Schematic capture; Part Placement; Constraints setting Electrical/DFA/DFM; Power split plan; Routing; Controlled impedance Length tuning & Post Gerber process.
Roles & Responsibilities: Designing of compact, high density, and high component count PCB layouts. Expertise in analyzing PCB feasibility – Layers / PCB size optimization activities. Closely interact with cross functional teams (HW, Mechanical, SI-PI & FAB house)