Mechanical Engineer, Packaging /System Design

About Eridu AI

Eridu AI is a Silicon Valley hardware startup revolutionizing AI training performance. Our innovative solutions address bottlenecks in data centers, enhancing GPU utilization, reducing training cycles, and lowering costs. Validated by AI market leaders, including hyperscalers and other large, well-known AI market participants, our technology is poised to unlock unparalleled AI performance

The company is led by a veteran team of
Silicon Valley executives and engineers with decades of experience in
state-of-the-art semiconductors, systems and software, including serial entrepreneur Drew
Perkins, Co-Founder of Infinera (NASDAQ: INFN, Lightera (acquired by
Ciena), Gainspeed (acquired by Nokia) and Mojo Vision (the world's leading
micro-LED display company and developer of the first augmented reality contact
lens).

Position Overview

We are seeking a highly motivated Mechanical Engineer to contribute to the definition and implementation of Eridu AI's cutting-edge Networking solution. This is an excellent opportunity for a self-starter who thrives on solving complex, real-world challenges. You will play a pivotal role in shaping the future of AI networking technologies.

Responsibilities

• Mechanical Design: Create and optimize the mechanical design of components and chassis for rack mounted computing and communication systems, including enclosures, chassis, air and liquid cooling systems and mounting structures for electrical and optical components, ensuring optimal performance, reliability, structural integrity, manufacturability, and thermal performance.
• Packaging Design: Create and optimize the mechanical design of IC packages considering factors
  such as thermal management, electrical performance, mechanical integrity, and
  manufacturability. Development of advanced packaging technologies (SMT, solder ball
  attach, and other assembly process) roadmap for networking products
  applications. Photonics integration preferred. Perform design analysis and
  what-if scenarios for novel packaging next generation technologies like Liquid cooling and Mechanical Design of robust package substrates.
• Material Selection: Choose appropriate
  materials for IC packaging based on their thermal, mechanical, and
  electrical properties to meFet performance requirements and reliability standards. Work
  with internal silicon, architecture and
  system teams and externally engaged partners, ODM, design houses and OSAT
  companies
• Simulation and Analysis: Conduct simulations and analyses (e.g.,
  finite element analysis, thermal analysis) to predict and optimize the structural integrity and thermal performance of electrical and
  optical packages under various conditions.
• Prototyping and Testing: Develop prototypes of system chassis and electrical/optical packages, conduct
  testing (e.g., thermal cycling, vibration testing) to validate designs, and
  iterate based on test results.
• Collaboration: Work closely with electrical engineers,
  semiconductor designers, and manufacturing teams to integrate electrical and optical packages into
  overall product designs and ensure compatibility.
• Documentation: Prepare documentation including design
  specifications, test procedures, and reports to communicate design concepts and
  results.
• Quality Assurance: Ensure compliance with industry standards
  and regulations related to system chassis and electrical/optical packaging and implement quality
  assurance processes.

Qualifications

• BS in Materials Science, Mechanical Engineering or equivalent industry experience
• 10+ years of experience in advanced packaging with surface mount technology and assembly process development and manufacturing
• In-depth knowledge of air and liquid cooling systems, flip chip, 2.5D and 3D packaging technologies including prior experience with TSV;s. Photonics package integration preferred.
• Experience taking products from concept to production including development of manufacturing specifications, vendor qualifications and improvement of manufacturing efficiencies and costs
• Effective communication skills. Experience working effectively with cross-functional teams
• CAD Tools: Proficiency in CAD software (e.g., SolidWorks, AutoCAD) for 3D modeling and design
• Effective communication skills. Experience working effectively with cross-functional teams
• Simulation Software: Experience with simulation tools (e.g., ANSYS, COMSOL) for analyzing thermal and mechanical behavior.

Why Join Us?

At Eridu AI, you'll have the opportunity to shape the future of AI
infrastructure, working with a world-class team on groundbreaking technology
that pushes the boundaries of AI performance. Your contributions will directly impact the next
generation of AI networking solutions, transforming data center capabilities.

The starting base salary for the selected candidate will be established based on their relevant skills, experience, qualifications, work location, market trends, and the compensation of employees in comparable roles.

The pay range for this role is:

210,000 - 300,000 USD per year (San Francisco Bay Area)