DBSI Services, Inc.
Package Design Engineer- Semiconductor Industry
DBSI Services, Inc., Milpitas, CA, United States
Benefits:
Location: Milpitas, CA
Description:
We are seeking a Senior Engineer, Package Design to work from our Milpitas, CA office.
ResponsibilitiesThe Package substrate design focus on signal and power integrities analyses as well as routing analyses. You will be reporting to the Director of Package Design (USA) and working very closely with Package design team in our parent company's headquarters in Japan and Marketing and Engineering teams located in our Milpitas office during the pre/post sales process.
This position requires a broad knowledge of package technology and design. Successful candidates will have a deep understanding and experience in the following areas: high performance build-up substrates, flip chip assembly or 2.5D packaging. Knowledge and experience in extracting/simulating package designs for Signal and Power integrities using tools such as HFSS, and/or ADS tools.
Education
• Bachelor's degree in Electrical Engineering, or other semiconductor packaging related discipline
• MS is preferred
Required Experience and Skills
• 8 to 10 years of experience in semiconductor packaging design, modeling, extraction, and simulations
• Record of success in cross-functional team environment
• Good experience with Signal and power integrity tools for package level modeling/extraction/simulation
• Ability to work with Package Layout engineers.
• Strong presentation and communication skills
Preferred Experience and Skills
• Hands on package design; high-speed Signa integrity and Power integrity and package decoupling caps optimizations, combined package and PCB Signal integrity and Power integrity Characterizations, impedance verification, high frequency s-parameters extraction, Hspice model, package Hspice and RLC model extraction and designs
• Hands on high-speed package and PCB design for: high-speed Serdes 112 Gbps, PCIeX5 and 6, LPDDR4,5, Ethernet 25 GBps, power aware SI/PI analysis, up to 40 GHZ s-parameters extraction and verification
• Packaging+PCB high-speed interconnections timing analyses, eye-diagram and jitter budgeting calculation following the LPDDR JEDEC spec, or other highs-speed frequency domain s-parameters extraction following the base Spec of high-speed interconnect
• Hands on PCB design; SI, PI analyses, decoupling caps optimizations, SI and PI Characterization and extractions, impedance verification, s-parameters verifications with lab measurements, Hspice model, PCB RLC model extraction and designs
• Packaging routing analyst, trace impedance analyses and package layout bump to ball analyses
• Package material characterization frequency dependent model; skin effects, smoothness, roughness, dielectric loss and dielectric constant
• PCB material characterization frequency dependent; routing degree of freedom
• Time domain analyses and jitter budgeting for PCIe2/3/4/5, Serdes 112 GBps, Ethernet 25 Gbps, LPDDR4/5X MIPI, high-speed frequency signaling
• Time domain analyses and budgeting model for LPDDR 3/4/5, LPDDRX 3/4/5/6
• Bathtub curve and BER analyses of high speed signaling
• DDR frequency and time domains model and jitter analyses and path findings to improve package and PCB layout and improve high-speed interconnections
• Clk jitter analyses, routing, clk tree analyses
• Simulating multi-physics electro-thermal analysis
• Collateral packaging manufacturing and assembly rules
• Chip and package Reliability analyses
• Die+Pkg+pcb PDN model time and frequency, Impedance profile, AC droop, DC drop DC, etc.
• IR drop, and CPM (chip power model) die model using Redhawk and other tolls
• Core PI: simulation capability, tool/flow and past experience on measurement capability, lab tool set up.
Compensation: $210,000.00 - $240,000.00 per year
MAKING THE INDUSTRY'S BEST MATCHES
DBSI Services is widely recognized as one of the industry's fastest growing staffing agencies. Thanks to our longstanding experience in various industries, we have the capacity to build meaningful, long-lasting relationships with all our clients. Our success is a result of our commitment to the best people, the best solutions and the best results.
Our Story:
Top performing engineers are the foundation of our business. Our priority is building strong
relationships with each employment candidate we work with. You can trust our professional
recruiters to invest the time required to fully understand your skills, explore your professional
goals and help you find the right career opportunities.
- 401(k)
- 401(k) matching
- Relocation bonus
Location: Milpitas, CA
Description:
We are seeking a Senior Engineer, Package Design to work from our Milpitas, CA office.
ResponsibilitiesThe Package substrate design focus on signal and power integrities analyses as well as routing analyses. You will be reporting to the Director of Package Design (USA) and working very closely with Package design team in our parent company's headquarters in Japan and Marketing and Engineering teams located in our Milpitas office during the pre/post sales process.
This position requires a broad knowledge of package technology and design. Successful candidates will have a deep understanding and experience in the following areas: high performance build-up substrates, flip chip assembly or 2.5D packaging. Knowledge and experience in extracting/simulating package designs for Signal and Power integrities using tools such as HFSS, and/or ADS tools.
Education
• Bachelor's degree in Electrical Engineering, or other semiconductor packaging related discipline
• MS is preferred
Required Experience and Skills
• 8 to 10 years of experience in semiconductor packaging design, modeling, extraction, and simulations
• Record of success in cross-functional team environment
• Good experience with Signal and power integrity tools for package level modeling/extraction/simulation
• Ability to work with Package Layout engineers.
• Strong presentation and communication skills
Preferred Experience and Skills
• Hands on package design; high-speed Signa integrity and Power integrity and package decoupling caps optimizations, combined package and PCB Signal integrity and Power integrity Characterizations, impedance verification, high frequency s-parameters extraction, Hspice model, package Hspice and RLC model extraction and designs
• Hands on high-speed package and PCB design for: high-speed Serdes 112 Gbps, PCIeX5 and 6, LPDDR4,5, Ethernet 25 GBps, power aware SI/PI analysis, up to 40 GHZ s-parameters extraction and verification
• Packaging+PCB high-speed interconnections timing analyses, eye-diagram and jitter budgeting calculation following the LPDDR JEDEC spec, or other highs-speed frequency domain s-parameters extraction following the base Spec of high-speed interconnect
• Hands on PCB design; SI, PI analyses, decoupling caps optimizations, SI and PI Characterization and extractions, impedance verification, s-parameters verifications with lab measurements, Hspice model, PCB RLC model extraction and designs
• Packaging routing analyst, trace impedance analyses and package layout bump to ball analyses
• Package material characterization frequency dependent model; skin effects, smoothness, roughness, dielectric loss and dielectric constant
• PCB material characterization frequency dependent; routing degree of freedom
• Time domain analyses and jitter budgeting for PCIe2/3/4/5, Serdes 112 GBps, Ethernet 25 Gbps, LPDDR4/5X MIPI, high-speed frequency signaling
• Time domain analyses and budgeting model for LPDDR 3/4/5, LPDDRX 3/4/5/6
• Bathtub curve and BER analyses of high speed signaling
• DDR frequency and time domains model and jitter analyses and path findings to improve package and PCB layout and improve high-speed interconnections
• Clk jitter analyses, routing, clk tree analyses
• Simulating multi-physics electro-thermal analysis
• Collateral packaging manufacturing and assembly rules
• Chip and package Reliability analyses
• Die+Pkg+pcb PDN model time and frequency, Impedance profile, AC droop, DC drop DC, etc.
• IR drop, and CPM (chip power model) die model using Redhawk and other tolls
• Core PI: simulation capability, tool/flow and past experience on measurement capability, lab tool set up.
Compensation: $210,000.00 - $240,000.00 per year
MAKING THE INDUSTRY'S BEST MATCHES
DBSI Services is widely recognized as one of the industry's fastest growing staffing agencies. Thanks to our longstanding experience in various industries, we have the capacity to build meaningful, long-lasting relationships with all our clients. Our success is a result of our commitment to the best people, the best solutions and the best results.
Our Story:
- Founded in 1995
- Privately Owned Corporation
- Managing Partner Business Model
- Headquartered in New Jersey
- US Based Engineers Only
- Collaborative Team Approach
- Methodology and Process Driven
Top performing engineers are the foundation of our business. Our priority is building strong
relationships with each employment candidate we work with. You can trust our professional
recruiters to invest the time required to fully understand your skills, explore your professional
goals and help you find the right career opportunities.