Micron Memory Malaysia Sdn Bhd
Package Development Engineering Core Engineering Module (PDE CEM) Engineer
Micron Memory Malaysia Sdn Bhd, Evergreen, Colorado, United States, 80439
Our vision is to transform how the world uses information to enrich life for
all .Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.JR48927 Package Development Engineering Core Engineering Module (PDE CEM) Engineer (Evergreen)
As a PDE CEM Engineer you will be primarily responsible for developing and optimizing processes to meet the schedule of business cases. You will work on new product introduction and improve yield, quality, and reliability with process characterization and optimization, as well as introducing new materials, machines, and technologies. You need to perform DOE and handle the NPI runs for recipe creation and verification to assess process performance and collect data for reports. You will also be required to identify, diagnose, and resolve assembly process-related problems by applying problem-solving skills.Job Responsibilities:
Execute smooth transfer of new products and packages from NPI to HVM site.Work with cross-functional teams and sites to execute smooth product transfers.Validate and document baseline the POR, TOR, and BOM for the transferred products and packages.Execute the qualification of NPI packages built from pilot products and packages according to planned timelines.Execute NPI Customer samples and Engineering Samples build for new products and packages according to planned timelines.Process Improvement:
Evaluate and improve assigned assembly processes, materials, and/or equipment.Participate in process, tool, and material optimization to drive best-in-class packaging solutions and ensure first-pass NPI qualification. Provide ideas for cost reduction.Maintain in-depth assembly process and packaging knowledge, including materials and equipment knowledge as packaging integration.Identify all process variables and optimize process and/or equipment variables.Perform containment of process and equipment deviations, lead root cause finding, and implement corrective actions.Process Development:
Develop Process of Record (POR), define process edges and center the process (CPK), and apply DOE (Design of Experiments) techniques for process characterization.Develop Process Capability Roadmap and evaluate equipment and/or material technologies.Job Requirements:
Master's or bachelor's degree in Engineering.Experience in backend engineering process or assembly package technology development preferred.At least 3 years of experience in the semiconductor industry; candidates with proven experience in wire bond, die attach, encapsulation, post-encapsulation, and wafer are highly encouraged to apply.Excellent problem-solving skills, and proficiency in data analysis, statistical analysis, and data interpretation.A good team player equipped with excellent interpersonal and communication skills.Highly results-driven individual, self-motivated, with the ability to multi-task and manage dynamic priorities.About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.To learn more, please visit micron.com/careers.All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran, or disability status.To request assistance with the application process and/or for reasonable accommodations, please contact
hrsupport_my@micron.com .Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
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all .Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.JR48927 Package Development Engineering Core Engineering Module (PDE CEM) Engineer (Evergreen)
As a PDE CEM Engineer you will be primarily responsible for developing and optimizing processes to meet the schedule of business cases. You will work on new product introduction and improve yield, quality, and reliability with process characterization and optimization, as well as introducing new materials, machines, and technologies. You need to perform DOE and handle the NPI runs for recipe creation and verification to assess process performance and collect data for reports. You will also be required to identify, diagnose, and resolve assembly process-related problems by applying problem-solving skills.Job Responsibilities:
Execute smooth transfer of new products and packages from NPI to HVM site.Work with cross-functional teams and sites to execute smooth product transfers.Validate and document baseline the POR, TOR, and BOM for the transferred products and packages.Execute the qualification of NPI packages built from pilot products and packages according to planned timelines.Execute NPI Customer samples and Engineering Samples build for new products and packages according to planned timelines.Process Improvement:
Evaluate and improve assigned assembly processes, materials, and/or equipment.Participate in process, tool, and material optimization to drive best-in-class packaging solutions and ensure first-pass NPI qualification. Provide ideas for cost reduction.Maintain in-depth assembly process and packaging knowledge, including materials and equipment knowledge as packaging integration.Identify all process variables and optimize process and/or equipment variables.Perform containment of process and equipment deviations, lead root cause finding, and implement corrective actions.Process Development:
Develop Process of Record (POR), define process edges and center the process (CPK), and apply DOE (Design of Experiments) techniques for process characterization.Develop Process Capability Roadmap and evaluate equipment and/or material technologies.Job Requirements:
Master's or bachelor's degree in Engineering.Experience in backend engineering process or assembly package technology development preferred.At least 3 years of experience in the semiconductor industry; candidates with proven experience in wire bond, die attach, encapsulation, post-encapsulation, and wafer are highly encouraged to apply.Excellent problem-solving skills, and proficiency in data analysis, statistical analysis, and data interpretation.A good team player equipped with excellent interpersonal and communication skills.Highly results-driven individual, self-motivated, with the ability to multi-task and manage dynamic priorities.About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.To learn more, please visit micron.com/careers.All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran, or disability status.To request assistance with the application process and/or for reasonable accommodations, please contact
hrsupport_my@micron.com .Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
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