Global Outsourcing
Senior Mechanical Engineer
Global Outsourcing, Woburn, Massachusetts, us, 01813
GISS Systems has been a leader in information technology consulting. GISS mission is to deliver results for its many Global clients through the design, development and implementation of leading edge enterprise technology solutions. GISS relentless focus on delivering results for its clients has made it one of the fastest growing companies in the United States since its founding.Job Description
Job Summary:Liaising with the hardware, thermal and PCB design engineers to agree on optimal layout and construction of the boards.Maintaining awareness of new technologies.Reporting to the Engineering Director on project progress.Required Education, Skills and Experience:In-depth knowledge of solid modelling, drawing, tolerances (GD&T), and change control processes.Design of small or precision mechanical components for high complexity densely packed embedded board level electronic sub-systems or similar environments.Ability to interface well with remote design teams.Familiarity with standard form factor designs, e.g. Open VPX (3U and 6U) or VME.Familiarity with shock and vibration testing in general, or of electronic board level systems in particular.Experience of team leading at a technical level.In addition to technical skills, the candidate must be independent and self-motivated but also able to interact with other engineers both locally and overseas.It is likely that the role will involve occasional travel to the UK, though this is unlikely to be frequent or for long periods.Qualifications
Mechanical Engineering graduates (BS or MS), able to demonstrate practical post-graduate involvement in embedded electronic product design.Additional Information
Required Education:Minimum of 5 years of electronics packaging experience designing, developing, documenting and testing board level and chassis level products.
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Job Summary:Liaising with the hardware, thermal and PCB design engineers to agree on optimal layout and construction of the boards.Maintaining awareness of new technologies.Reporting to the Engineering Director on project progress.Required Education, Skills and Experience:In-depth knowledge of solid modelling, drawing, tolerances (GD&T), and change control processes.Design of small or precision mechanical components for high complexity densely packed embedded board level electronic sub-systems or similar environments.Ability to interface well with remote design teams.Familiarity with standard form factor designs, e.g. Open VPX (3U and 6U) or VME.Familiarity with shock and vibration testing in general, or of electronic board level systems in particular.Experience of team leading at a technical level.In addition to technical skills, the candidate must be independent and self-motivated but also able to interact with other engineers both locally and overseas.It is likely that the role will involve occasional travel to the UK, though this is unlikely to be frequent or for long periods.Qualifications
Mechanical Engineering graduates (BS or MS), able to demonstrate practical post-graduate involvement in embedded electronic product design.Additional Information
Required Education:Minimum of 5 years of electronics packaging experience designing, developing, documenting and testing board level and chassis level products.
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