Northrop Grumman
Principal/Sr. Principal Engineer RF Microwave Design
Northrop Grumman, Baltimore, Maryland, United States, 21276
Principal/Sr. Principal Engineer RF Microwave Design
Requisition ID:
R10169829
Location:
Baltimore, Maryland, United States of AmericaClearance Type:
SecretTelecommute:
No- Teleworking not available for this positionShift:
1st Shift (United States of America)Travel Required:
Yes, 10% of the TimeRelocation Assistance:
Relocation assistance may be availablePositions Available:
3AMS E&S is seeking engineers with experience and interest in electronic assembly and packaging design.What You’ll get to Do:Designing, modeling, and verifying RF/microwave, and mixed signal assemblies and subsystemsUtilize analysis, simulations and prototyping to develop antenna and signal conversion designsDeriving and trading requirements with components, assembly and subsystem engineersPerforming electromagnetic simulation of component, assembly, and subsystem level performanceManaging RF budgets, frequency planning, and common assembly level interfacesPredicting assembly level performance through selecting materials, components, and packaging approaches, RF chain analysis, electromagnetic simulation, data collection and analysis, and other modeling techniquesDevelop custom RF integrated circuit designs to meet assembly and subsystem level requirementsCollaborating with peer functions such as Mechanical, Manufacturing, Quality, Supply Chain, and TestUtilizing world class manufacturing capabilities both on-site and within the broader company for prototyping through full rate production from the foundry level to microelectronic packaging to printed circuit board fabrication and assembly to subsystem level integration and testWorking directly with a wide variety of different external supplier partners including leading domestic foundries, printed circuit board fabricators and assemblers, component manufacturers, material fabricators, and moreSupporting products throughout the product life cycle (EMD, production, sustainment, DMS)RF and mixed signal assembly product types include
antenna
radiators, circulators, device interposers, filters, manifolds,
receiver / exciter assemblies , signal conditioning assemblies, signal generators, and transmit / receive assembliesRF and mixed signal subsystem product types include
antenna and receiver/exciter subsystemsThis requisition may be filled as a Principal Engineer or a Sr. Principal Engineer.Principal Engineer Basic Qualifications:Electrical Engineering or related STEM field degree: Bachelor of Science with 5 years of RF/microwave experience; Masters degree with 3 years of RF/microwave experience; or PhD degree. an additional 4 years of experience will be considered in lieu of a degreeUS Citizenship is requiredMust have Full Secret Clearance Minimum Prior to startAbility to provide sound solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty. Solutions are imaginative, thorough, and practical.Developing subject matter expertise in one or more areas of RF/Microwave discipline including but not limited to: RF components, assemblies, subsystems, requirements development, EM and related modeling & simulation, RF test verification, production test support, and design for producibilityExhibit intermediate to expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (i.e. ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA)Proven knowledge of electrical engineering design software and equipmentSenior Principal Engineer Basic Qualifications:Electrical Engineering or related STEM field degree: Bachelor of Science with 8 years of RF/microwave experience; Masters degree with 6 years of RF/microwave experience; PhD degree with 3 years of experience. An additional 4 years of experience will be considered in lieu of a degree.US Citizenship is required.Must have Full Secret Clearance Minimum Prior to startAbility to provide innovative solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty. Solutions are imaginative, thorough, and practical.Demonstrated subject matter expertise in one or more areas of RF/Microwave discipline including but not limited to: RF components, assemblies, subsystems, requirements development, EM and related modeling & simulation, RF test verification, production test support, and design for producibilityExhibit expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (i.e. ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA)Expert knowledge of electrical engineering design software and equipment.Preferred Qualifications for both Principal and Senior Principal roles:Top Secret / SCI security clearanceRF and mixed signal printed circuit board and circuit card assembly and subsystem level designsRF budgeting, frequency planning, RF chain analysis and modeling, schematic capture, electromagnetic simulation, signal integrity analysisComponent selection and/or custom component requirements flow down and tradesCeramic and organic printed circuit board materials, design, fabrication, and assembly processesIntegrated Circuit packaging techniques including chip-and-wire, QFN, flip-chipRF lab equipment such as network analyzers, spectrum analyzers, signal generators, power meters, etc.Electronic troubleshooting from component to assembly/subsystem levelsComplex data reduction and analysisProduct life cycle support from concept through production supportDesigning for high reliability, mil/aero requirements and environmentsAESA / phased array, Receiver/Exciter, Digital Arrays, Radar, SIGINT, or SATCOM experienceTechnical team leadershipExperience in the Aerospace or Defense IndustrySoftware tools: Mentor Xpedition DX Designer, ANSYS HFSS, CST Microwave, FEKO, TICRA, Keysight ADS, Keysight Genesys,
MathWorks MATLAB , Autodesk AutoCAD, and Microsoft Office Suite (Excel, PowerPoint, Project, Word)This role is contingent upon a Final Clearance to start.Salary Range:
$102,400 - $153,600Salary Range 2:
$127,000 - $190,600The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.
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Requisition ID:
R10169829
Location:
Baltimore, Maryland, United States of AmericaClearance Type:
SecretTelecommute:
No- Teleworking not available for this positionShift:
1st Shift (United States of America)Travel Required:
Yes, 10% of the TimeRelocation Assistance:
Relocation assistance may be availablePositions Available:
3AMS E&S is seeking engineers with experience and interest in electronic assembly and packaging design.What You’ll get to Do:Designing, modeling, and verifying RF/microwave, and mixed signal assemblies and subsystemsUtilize analysis, simulations and prototyping to develop antenna and signal conversion designsDeriving and trading requirements with components, assembly and subsystem engineersPerforming electromagnetic simulation of component, assembly, and subsystem level performanceManaging RF budgets, frequency planning, and common assembly level interfacesPredicting assembly level performance through selecting materials, components, and packaging approaches, RF chain analysis, electromagnetic simulation, data collection and analysis, and other modeling techniquesDevelop custom RF integrated circuit designs to meet assembly and subsystem level requirementsCollaborating with peer functions such as Mechanical, Manufacturing, Quality, Supply Chain, and TestUtilizing world class manufacturing capabilities both on-site and within the broader company for prototyping through full rate production from the foundry level to microelectronic packaging to printed circuit board fabrication and assembly to subsystem level integration and testWorking directly with a wide variety of different external supplier partners including leading domestic foundries, printed circuit board fabricators and assemblers, component manufacturers, material fabricators, and moreSupporting products throughout the product life cycle (EMD, production, sustainment, DMS)RF and mixed signal assembly product types include
antenna
radiators, circulators, device interposers, filters, manifolds,
receiver / exciter assemblies , signal conditioning assemblies, signal generators, and transmit / receive assembliesRF and mixed signal subsystem product types include
antenna and receiver/exciter subsystemsThis requisition may be filled as a Principal Engineer or a Sr. Principal Engineer.Principal Engineer Basic Qualifications:Electrical Engineering or related STEM field degree: Bachelor of Science with 5 years of RF/microwave experience; Masters degree with 3 years of RF/microwave experience; or PhD degree. an additional 4 years of experience will be considered in lieu of a degreeUS Citizenship is requiredMust have Full Secret Clearance Minimum Prior to startAbility to provide sound solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty. Solutions are imaginative, thorough, and practical.Developing subject matter expertise in one or more areas of RF/Microwave discipline including but not limited to: RF components, assemblies, subsystems, requirements development, EM and related modeling & simulation, RF test verification, production test support, and design for producibilityExhibit intermediate to expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (i.e. ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA)Proven knowledge of electrical engineering design software and equipmentSenior Principal Engineer Basic Qualifications:Electrical Engineering or related STEM field degree: Bachelor of Science with 8 years of RF/microwave experience; Masters degree with 6 years of RF/microwave experience; PhD degree with 3 years of experience. An additional 4 years of experience will be considered in lieu of a degree.US Citizenship is required.Must have Full Secret Clearance Minimum Prior to startAbility to provide innovative solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty. Solutions are imaginative, thorough, and practical.Demonstrated subject matter expertise in one or more areas of RF/Microwave discipline including but not limited to: RF components, assemblies, subsystems, requirements development, EM and related modeling & simulation, RF test verification, production test support, and design for producibilityExhibit expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (i.e. ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA)Expert knowledge of electrical engineering design software and equipment.Preferred Qualifications for both Principal and Senior Principal roles:Top Secret / SCI security clearanceRF and mixed signal printed circuit board and circuit card assembly and subsystem level designsRF budgeting, frequency planning, RF chain analysis and modeling, schematic capture, electromagnetic simulation, signal integrity analysisComponent selection and/or custom component requirements flow down and tradesCeramic and organic printed circuit board materials, design, fabrication, and assembly processesIntegrated Circuit packaging techniques including chip-and-wire, QFN, flip-chipRF lab equipment such as network analyzers, spectrum analyzers, signal generators, power meters, etc.Electronic troubleshooting from component to assembly/subsystem levelsComplex data reduction and analysisProduct life cycle support from concept through production supportDesigning for high reliability, mil/aero requirements and environmentsAESA / phased array, Receiver/Exciter, Digital Arrays, Radar, SIGINT, or SATCOM experienceTechnical team leadershipExperience in the Aerospace or Defense IndustrySoftware tools: Mentor Xpedition DX Designer, ANSYS HFSS, CST Microwave, FEKO, TICRA, Keysight ADS, Keysight Genesys,
MathWorks MATLAB , Autodesk AutoCAD, and Microsoft Office Suite (Excel, PowerPoint, Project, Word)This role is contingent upon a Final Clearance to start.Salary Range:
$102,400 - $153,600Salary Range 2:
$127,000 - $190,600The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.
#J-18808-Ljbffr