ZipRecruiter
Principal Signoff Solutions Engineer
ZipRecruiter, San Diego, California, United States, 92189
Job Overview:
Arm is leading the vision to unlock a broad ecosystem of silicon required for AI, Data centers, mobile, compute and IoT. As a member of Solution engineering, you will be joining a team developing end-to-end sign-off methodology for system timing, power, thermal, test, and yield, implementation, post-silicon characterization and tuning for highly complex industry leading compute and multi-die SoCs.
The position requires delivering solution and automation for accurate analysis and co-optimization across all sign-off domains including RC, STA, PDN, Power, and yield for system convergence. The position also gives opportunity for leading product level implementation and sign-off. Outstanding expertise in EDA tool-flows and delivery of large scale automation is required for meticulous optimization of power-perf trade-off. The role also brings opportunity to collaborate with foundry, EDA and ecosystem partners in 3nm/2nm technodes and multi-die.
Responsibilities:
Develop multi-die sign-off flow and automation for best-in-class Fmax and Power/GHz.
Develop PVT, Vdrop and thermal aware methodology and flows enabling custom techniques in multi-voltage design, advanced clocking, critical path analysis and silicon variation.
Infuse innovative industry tools and internally developed statistical, analytical algorithms and machine learning methodologies to develop and refine STA and IR-PDN-Thermal bottlenecks.
The suitable candidate will be able to analyze the requirements, define and develop CAD solution including external EDA tools integration.
Ability to lead a product implementation and sign-off, working closely with internal design teams, foundry and partners.
Required Skills and Experience:
Strong expertise with end-to-end silicon convergence with IP characterization, EDA algorithms, RC, STA and PDN analysis for both on-chip and package.
Hands-on experience developing large scale automation for co-optimization of PPA and sign-off.
Hands-on experience with analyzing data for measurable contributions to sign-off methodology and workflows.
Strong coding proficiency in Python, C, Tcl.
Proficiency with version control systems like git, distributed processing, and disk management.
“Nice To Have” Skills and Experience:
Experience with multi-die SoC design flows, IR and STA convergence and subject areas SoC interfaces, budgeting, constraints, UPF.
Ability to work with evolving problem statements and solutions. Excellent interpersonal skills, communication, team spirit and effective collaboration with multi-functional teams.
Salary Range:
From: $221,127
To: $299,172
We value people as individuals and our dedication is to reward people competitively and equitably for the work they do and the skills and experience they bring to Arm. Salary is only one component of Arm’s offering. The total reward package will be shared with candidates during the recruitment and selection process.
In Return:
Partner and customer focus.
Teamwork and communication.
Creativity and innovation.
Team and personal development.
Impact and influence.
Deliver on your promises.
#LI-AC1
#J-18808-Ljbffr
Arm is leading the vision to unlock a broad ecosystem of silicon required for AI, Data centers, mobile, compute and IoT. As a member of Solution engineering, you will be joining a team developing end-to-end sign-off methodology for system timing, power, thermal, test, and yield, implementation, post-silicon characterization and tuning for highly complex industry leading compute and multi-die SoCs.
The position requires delivering solution and automation for accurate analysis and co-optimization across all sign-off domains including RC, STA, PDN, Power, and yield for system convergence. The position also gives opportunity for leading product level implementation and sign-off. Outstanding expertise in EDA tool-flows and delivery of large scale automation is required for meticulous optimization of power-perf trade-off. The role also brings opportunity to collaborate with foundry, EDA and ecosystem partners in 3nm/2nm technodes and multi-die.
Responsibilities:
Develop multi-die sign-off flow and automation for best-in-class Fmax and Power/GHz.
Develop PVT, Vdrop and thermal aware methodology and flows enabling custom techniques in multi-voltage design, advanced clocking, critical path analysis and silicon variation.
Infuse innovative industry tools and internally developed statistical, analytical algorithms and machine learning methodologies to develop and refine STA and IR-PDN-Thermal bottlenecks.
The suitable candidate will be able to analyze the requirements, define and develop CAD solution including external EDA tools integration.
Ability to lead a product implementation and sign-off, working closely with internal design teams, foundry and partners.
Required Skills and Experience:
Strong expertise with end-to-end silicon convergence with IP characterization, EDA algorithms, RC, STA and PDN analysis for both on-chip and package.
Hands-on experience developing large scale automation for co-optimization of PPA and sign-off.
Hands-on experience with analyzing data for measurable contributions to sign-off methodology and workflows.
Strong coding proficiency in Python, C, Tcl.
Proficiency with version control systems like git, distributed processing, and disk management.
“Nice To Have” Skills and Experience:
Experience with multi-die SoC design flows, IR and STA convergence and subject areas SoC interfaces, budgeting, constraints, UPF.
Ability to work with evolving problem statements and solutions. Excellent interpersonal skills, communication, team spirit and effective collaboration with multi-functional teams.
Salary Range:
From: $221,127
To: $299,172
We value people as individuals and our dedication is to reward people competitively and equitably for the work they do and the skills and experience they bring to Arm. Salary is only one component of Arm’s offering. The total reward package will be shared with candidates during the recruitment and selection process.
In Return:
Partner and customer focus.
Teamwork and communication.
Creativity and innovation.
Team and personal development.
Impact and influence.
Deliver on your promises.
#LI-AC1
#J-18808-Ljbffr