Micron Memory Malaysia Sdn Bhd
NAND Process Integration Director/DMTS - TPG
Micron Memory Malaysia Sdn Bhd, Boise, Idaho, United States, 83708
Our vision is to transform how the world uses information to enrich life for
all .Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.Micron is a global leader in NAND technology and storage solutions, pushing the boundaries of semiconductor possibilities. As the leader of
NAND Process Integration
in the Technology Development team, you will be responsible for delivering industry-leading NAND technology nodes, with a focus on the array, to our manufacturing sites through close collaboration with the pathfinding team, process development teams, and device and design teams. Extended travel to our Singapore site for transfer support in the form of EIBT or expat assignment will be required.Leader Responsibilities:
Establish program timelines and milestones to align with Micron’s product plans for the node.Set priorities and define clear goals for the program to deliver on business commits.Drive structural and electrical spec definition to meet technology requirements for next-generation NAND array.Collaborate with Process Development, Yield Technology, Device, and Design and Product Engineering teams to define and drive roadmaps to close technology gaps and enable best-in-class yield, performance, and cost.Coordinate resource planning and milestones with global partner teams to ensure alignment with business plans. Provide strategic inputs to fab planning teams regarding silicon needs and serve as the Integration leader for MOR accuracy, updates, and contingencies.Oversee tactical line management through effective engineering efforts and collaboration with operations and process teams to drive strong execution. Provide cross-functional leadership to ensure coordination and focus among multiple teams and partners.Lead, manage, and develop a team of NAND process integration leaders and engineers, fostering talent development and people leadership to build a motivated and high-performing team.Cultivate a culture of continuous excellence, psychological safety, inclusion, collaboration, and a strong sense of ownership and engagement across geographies.Advocate for and drive model-based problem-solving methodologies for a disciplined approach to addressing key issues.Summarize complex problems and communicate solutions and execution plans to executive leadership through regular program and metrics updates.Ensure seamless communication across all departments and sites, transcending organizational boundaries.Qualifications:
Minimum of 5 years of technical leadership experience in process integration or process development, demonstrating strong interpersonal and technical skills.Over 10 years of experience in R&D or Technology Development, including leadership of multi-functional teams.Extensive understanding of mainstream memory technologies such as DRAM and NAND, evidenced by significant contributions.In-depth knowledge of semiconductor process integration, process development, and memory architectures.Comprehensive understanding of semiconductor device physics and material science.Expertise in Design of Experiments principles, problem-solving methodologies, and analytical skills.Proven project management skills with experience in leading cross-functional and global technical teams.Demonstrated ability to deliver innovative technology solutions and effectively resolve complex issues across multiple groups through strong execution skills.Exceptional communication and presentation skills, with a proven track record in setting technical direction.Innovation track record with a proactive and growth-mindset approach to exploring new ideas and adapting swiftly to change.Education:
MS degree (required) or PhD (preferred) in Physics, Materials Science & Engineering, Electrical Engineering, or a similar technical field.10+ years of relevant industry experience.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.
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all .Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.Micron is a global leader in NAND technology and storage solutions, pushing the boundaries of semiconductor possibilities. As the leader of
NAND Process Integration
in the Technology Development team, you will be responsible for delivering industry-leading NAND technology nodes, with a focus on the array, to our manufacturing sites through close collaboration with the pathfinding team, process development teams, and device and design teams. Extended travel to our Singapore site for transfer support in the form of EIBT or expat assignment will be required.Leader Responsibilities:
Establish program timelines and milestones to align with Micron’s product plans for the node.Set priorities and define clear goals for the program to deliver on business commits.Drive structural and electrical spec definition to meet technology requirements for next-generation NAND array.Collaborate with Process Development, Yield Technology, Device, and Design and Product Engineering teams to define and drive roadmaps to close technology gaps and enable best-in-class yield, performance, and cost.Coordinate resource planning and milestones with global partner teams to ensure alignment with business plans. Provide strategic inputs to fab planning teams regarding silicon needs and serve as the Integration leader for MOR accuracy, updates, and contingencies.Oversee tactical line management through effective engineering efforts and collaboration with operations and process teams to drive strong execution. Provide cross-functional leadership to ensure coordination and focus among multiple teams and partners.Lead, manage, and develop a team of NAND process integration leaders and engineers, fostering talent development and people leadership to build a motivated and high-performing team.Cultivate a culture of continuous excellence, psychological safety, inclusion, collaboration, and a strong sense of ownership and engagement across geographies.Advocate for and drive model-based problem-solving methodologies for a disciplined approach to addressing key issues.Summarize complex problems and communicate solutions and execution plans to executive leadership through regular program and metrics updates.Ensure seamless communication across all departments and sites, transcending organizational boundaries.Qualifications:
Minimum of 5 years of technical leadership experience in process integration or process development, demonstrating strong interpersonal and technical skills.Over 10 years of experience in R&D or Technology Development, including leadership of multi-functional teams.Extensive understanding of mainstream memory technologies such as DRAM and NAND, evidenced by significant contributions.In-depth knowledge of semiconductor process integration, process development, and memory architectures.Comprehensive understanding of semiconductor device physics and material science.Expertise in Design of Experiments principles, problem-solving methodologies, and analytical skills.Proven project management skills with experience in leading cross-functional and global technical teams.Demonstrated ability to deliver innovative technology solutions and effectively resolve complex issues across multiple groups through strong execution skills.Exceptional communication and presentation skills, with a proven track record in setting technical direction.Innovation track record with a proactive and growth-mindset approach to exploring new ideas and adapting swiftly to change.Education:
MS degree (required) or PhD (preferred) in Physics, Materials Science & Engineering, Electrical Engineering, or a similar technical field.10+ years of relevant industry experience.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.
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