Micron Memory Malaysia Sdn Bhd
Principal Hardware Development Engineer with FW Experience - TPG
Micron Memory Malaysia Sdn Bhd, San Jose, California, United States, 95199
Our vision is to transform how the world uses information to enrich life for
all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is looking for a principal HW development engineer to join our team! Principal Design Engineering position in the fast-paced Central Engineering HW Group at Micron Technology, Inc. As a core principal technical individual contributor in the architecture, design, validation, bring up, and release to manufacturing of systems including memory technologies, ASIC design, FPGAs, digital/mix-signal, analog & power supplies. You will need to have proven knowledge and extensive experience developing systems based on the above-mentioned technologies as well as high speed transmission line theory and application, mechanical and thermal design characterization. The position will require hands-on system bring-up, characterization and debugging as well as knowledge of laboratory equipment such as oscilloscopes and logic and protocol analyzers. This is a highly transparent and ambitious role, and you will be working very closely with other development groups such as software, firmware, Media, and ASIC. Crucial Duties and Responsibilities : Architect, design, bring up, test, validate & release to our manufacturing sophisticated electronic systems and modules based on product marketing requirements and on new memory technologies, ASICs, FPGAs, digital, mix-signal, analog circuitry and power supplies. Architect and craft by following standard methodologies for signal and power integrity as well as thermal/mechanical design and implementation. Define and implement test and validation plans including detailed design reviews of all major sub-assemblies to guarantee only one prototype leading to the final system/module revision, and MTBF prediction, FMEA, component derating, margin test, etc. to guarantee the highest quality and reliability. Supervise the component placement, layout and fabrication of modules & systems. Support product certification activities, NPI, production and manufacturing, including product transfer from Engineering to manufacturing and materials procurement. Find opportunities for improvement in the way we operate and work and help implement them with management support leading to a more efficient, agile and higher quality product development process. Education/Experience requirements : BS in Electrical Engineering/Electronics Engineering (or equivalent experience) with a proven record (typically 15+ years) OR MS Electrical Engineering/Electronics Engineering (or equivalent) with proven experience (typically 10+ years) Validated experience (7+ years) in the Storage Industry architecting, developing, and shipping to our customers. Experience in the design and development of embedded systems and FPGA FW. Proficiency in CAD tools such as OrCAD CIS, HDL, Allegro PCB, Allegro SI, PLM tools & SolidWorks and programming languages such as Verilog, VHDL and Python. Knowledge and/or experience of storage and memory sub-systems, including PCIe, NAND and DDR technologies. Ability to establish and maintain good relationships with colleagues. Self-motivated, self-directed, and a standout colleague (on the same team and outside of the team).
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all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is looking for a principal HW development engineer to join our team! Principal Design Engineering position in the fast-paced Central Engineering HW Group at Micron Technology, Inc. As a core principal technical individual contributor in the architecture, design, validation, bring up, and release to manufacturing of systems including memory technologies, ASIC design, FPGAs, digital/mix-signal, analog & power supplies. You will need to have proven knowledge and extensive experience developing systems based on the above-mentioned technologies as well as high speed transmission line theory and application, mechanical and thermal design characterization. The position will require hands-on system bring-up, characterization and debugging as well as knowledge of laboratory equipment such as oscilloscopes and logic and protocol analyzers. This is a highly transparent and ambitious role, and you will be working very closely with other development groups such as software, firmware, Media, and ASIC. Crucial Duties and Responsibilities : Architect, design, bring up, test, validate & release to our manufacturing sophisticated electronic systems and modules based on product marketing requirements and on new memory technologies, ASICs, FPGAs, digital, mix-signal, analog circuitry and power supplies. Architect and craft by following standard methodologies for signal and power integrity as well as thermal/mechanical design and implementation. Define and implement test and validation plans including detailed design reviews of all major sub-assemblies to guarantee only one prototype leading to the final system/module revision, and MTBF prediction, FMEA, component derating, margin test, etc. to guarantee the highest quality and reliability. Supervise the component placement, layout and fabrication of modules & systems. Support product certification activities, NPI, production and manufacturing, including product transfer from Engineering to manufacturing and materials procurement. Find opportunities for improvement in the way we operate and work and help implement them with management support leading to a more efficient, agile and higher quality product development process. Education/Experience requirements : BS in Electrical Engineering/Electronics Engineering (or equivalent experience) with a proven record (typically 15+ years) OR MS Electrical Engineering/Electronics Engineering (or equivalent) with proven experience (typically 10+ years) Validated experience (7+ years) in the Storage Industry architecting, developing, and shipping to our customers. Experience in the design and development of embedded systems and FPGA FW. Proficiency in CAD tools such as OrCAD CIS, HDL, Allegro PCB, Allegro SI, PLM tools & SolidWorks and programming languages such as Verilog, VHDL and Python. Knowledge and/or experience of storage and memory sub-systems, including PCIe, NAND and DDR technologies. Ability to establish and maintain good relationships with colleagues. Self-motivated, self-directed, and a standout colleague (on the same team and outside of the team).
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