Micron Memory Malaysia Sdn Bhd
Principal Hardware Development Engineer - TPG
Micron Memory Malaysia Sdn Bhd, San Jose, California, United States, 95199
Our vision is to transform how the world uses information to enrich life for
all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology’s vision is to transform how the world uses information to enrich life and our dedication to people, innovation, tenacity, partnership, and customer focus allows us to fulfill our mission to be a global leader in memory & storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community. Micron Technology is looking for a Principal Hardware Development Engineer! This is a Principal Design Engineering position in the fast-paced Central Engineering HW Group at Micron Technology, Inc. As a core principal technical individual contributor, you will be involved in the architecture, design, bring up, validation, and release to manufacturing of systems based on new memory technologies, ASICs, FPGAs, digital, mix-signal, analog circuitry, and power supplies. You will need to have proven knowledge and extensive experience developing systems based on the above-mentioned technologies, as well as high-speed transmission line theory and application, mechanical design, and thermal design and characterization. The position will require hands-on system bring-up, characterization, and debugging, as well as knowledge of laboratory equipment such as oscilloscopes and logic and protocol analyzers. This is a highly visible and ambitious role, and you will work closely with other development groups such as software, firmware, Media, and ASIC. Duties and Responsibilities : Architect, design, bring up, test, validate, and release to manufacturing sophisticated electronic systems and modules based on product marketing requirements and on new memory technologies, ASICs, FPGAs, digital, mix-signal, analog circuitry, and power supplies. Architect and craft such electronics systems and modules by following standard methodologies for signal and power integrity as well as mechanical and thermal design implementation. Define and implement test and validation plans including detailed design reviews of all major sub-assemblies to guarantee only one prototype leading to the final system/module revision, and MTBF prediction, FMEA, component derating, margin test, etc. to guarantee the highest quality and reliability. Supervise the component placement, layout, and fabrication of the systems and modules. Support product certification activities, NPI, production, and manufacturing, including product transfer from Engineering to manufacturing and materials procurement. Find opportunities for improvement in the way we operate and work and help implement them with management support leading to a more efficient, agile, and higher quality product development process. Education/Experience requirements : BS in Electrical Engineering or Electronics Engineering (or equivalent) with 15+ years of experience; MS in Electrical Engineering, Electronics Engineering with 10+ years of experience. Validated experience (7 years) in the Storage Industry architecting, developing, and shipping to customers memory and storage solutions and products. Proficiency in CAD tools such as OrCAD CIS, HDL, Allegro PCB, Allegro SI, PLM tools & SolidWorks. Knowledge and/or experience of storage and memory sub-systems, including PCIe, NAND, and DDR technologies. Ability to establish and maintain good relationships with colleagues. Self-motivated, self-directed, and a standout colleague (on the same team and outside of the team). The US base salary range that Micron Technology estimates it could pay for this full-time position is: $153,000.00 - $312,000.00 Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure, and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Additional compensation may include benefits, discretionary bonuses, and equity. Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws. To learn more about Micron, please visit
micron.com/careers
#J-18808-Ljbffr
all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology’s vision is to transform how the world uses information to enrich life and our dedication to people, innovation, tenacity, partnership, and customer focus allows us to fulfill our mission to be a global leader in memory & storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community. Micron Technology is looking for a Principal Hardware Development Engineer! This is a Principal Design Engineering position in the fast-paced Central Engineering HW Group at Micron Technology, Inc. As a core principal technical individual contributor, you will be involved in the architecture, design, bring up, validation, and release to manufacturing of systems based on new memory technologies, ASICs, FPGAs, digital, mix-signal, analog circuitry, and power supplies. You will need to have proven knowledge and extensive experience developing systems based on the above-mentioned technologies, as well as high-speed transmission line theory and application, mechanical design, and thermal design and characterization. The position will require hands-on system bring-up, characterization, and debugging, as well as knowledge of laboratory equipment such as oscilloscopes and logic and protocol analyzers. This is a highly visible and ambitious role, and you will work closely with other development groups such as software, firmware, Media, and ASIC. Duties and Responsibilities : Architect, design, bring up, test, validate, and release to manufacturing sophisticated electronic systems and modules based on product marketing requirements and on new memory technologies, ASICs, FPGAs, digital, mix-signal, analog circuitry, and power supplies. Architect and craft such electronics systems and modules by following standard methodologies for signal and power integrity as well as mechanical and thermal design implementation. Define and implement test and validation plans including detailed design reviews of all major sub-assemblies to guarantee only one prototype leading to the final system/module revision, and MTBF prediction, FMEA, component derating, margin test, etc. to guarantee the highest quality and reliability. Supervise the component placement, layout, and fabrication of the systems and modules. Support product certification activities, NPI, production, and manufacturing, including product transfer from Engineering to manufacturing and materials procurement. Find opportunities for improvement in the way we operate and work and help implement them with management support leading to a more efficient, agile, and higher quality product development process. Education/Experience requirements : BS in Electrical Engineering or Electronics Engineering (or equivalent) with 15+ years of experience; MS in Electrical Engineering, Electronics Engineering with 10+ years of experience. Validated experience (7 years) in the Storage Industry architecting, developing, and shipping to customers memory and storage solutions and products. Proficiency in CAD tools such as OrCAD CIS, HDL, Allegro PCB, Allegro SI, PLM tools & SolidWorks. Knowledge and/or experience of storage and memory sub-systems, including PCIe, NAND, and DDR technologies. Ability to establish and maintain good relationships with colleagues. Self-motivated, self-directed, and a standout colleague (on the same team and outside of the team). The US base salary range that Micron Technology estimates it could pay for this full-time position is: $153,000.00 - $312,000.00 Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure, and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Additional compensation may include benefits, discretionary bonuses, and equity. Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws. To learn more about Micron, please visit
micron.com/careers
#J-18808-Ljbffr