Western Digital Capital
Technologist - Thin Film Process
Western Digital Capital, Fremont, California, us, 94537
Job Type (exemption status): Exempt position - Please see related compensation & benefits details belowSalary Range: 126,935.60-179,800.00Business Function: Process EngineeringWork Location: Fremont Office--LOC_WDT_USCA13Company Description
At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we’ve been doing just that.We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world’s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital, G-Technology, SanDisk and WD brands.Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.Job Description
Job Description SummaryWe are seeking a highly motivated candidate to join our thin film process group. In this role, the candidate will take an overall leader role in technical aspects and team collaboration to provide engineering support to the thin film deposition processes in manufacture lines in order to meet manufacturing objectives with high quality, high productivity, and low-cost products, as well as support the development of future generation products.Essential Duties and ResponsibilitiesLead thin-film process team to deliver wafers with good quality and meet the demand. Respond to requests in a timely manner; able to resolve problems efficiently.Ensure quality and minimize risks of damages to products by improving process margin and robustness of detection and procedure.Lead projects and deliver results on schedule, including failure analysis, troubleshooting production line issues, yield improvement, new tool or new process development, and cost reduction.Collaborate with cross-functional teams to smoothly transfer new processes and products to production.Set up and improve automation systems and working instruction documents. Provide training instruction to operators.Support fab production 24/7, including taking immediate action on fab issues.Qualifications
Substantial academic background in Material Science, Physics, Chemistry, or related engineering fields.Experience in wafer fab operations/processes in Data Storage and/or Semiconductor technology industries.Demonstrate strong technical knowledge in thin film deposition processes (PVD, CVD, IBD, etc.), and a solid background in the correlation of process and equipment hardware.Deep understanding of material characterization techniques. Knowledge of magnetic material processes and characterization is a plus.Knowledge of DOE and data analysis using JMP.Understanding of SPC.Systematic troubleshooting and problem-solving skills.Leadership and communication skills, and a good team player.Self-motivated with good project management skills.
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At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we’ve been doing just that.We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world’s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital, G-Technology, SanDisk and WD brands.Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.Job Description
Job Description SummaryWe are seeking a highly motivated candidate to join our thin film process group. In this role, the candidate will take an overall leader role in technical aspects and team collaboration to provide engineering support to the thin film deposition processes in manufacture lines in order to meet manufacturing objectives with high quality, high productivity, and low-cost products, as well as support the development of future generation products.Essential Duties and ResponsibilitiesLead thin-film process team to deliver wafers with good quality and meet the demand. Respond to requests in a timely manner; able to resolve problems efficiently.Ensure quality and minimize risks of damages to products by improving process margin and robustness of detection and procedure.Lead projects and deliver results on schedule, including failure analysis, troubleshooting production line issues, yield improvement, new tool or new process development, and cost reduction.Collaborate with cross-functional teams to smoothly transfer new processes and products to production.Set up and improve automation systems and working instruction documents. Provide training instruction to operators.Support fab production 24/7, including taking immediate action on fab issues.Qualifications
Substantial academic background in Material Science, Physics, Chemistry, or related engineering fields.Experience in wafer fab operations/processes in Data Storage and/or Semiconductor technology industries.Demonstrate strong technical knowledge in thin film deposition processes (PVD, CVD, IBD, etc.), and a solid background in the correlation of process and equipment hardware.Deep understanding of material characterization techniques. Knowledge of magnetic material processes and characterization is a plus.Knowledge of DOE and data analysis using JMP.Understanding of SPC.Systematic troubleshooting and problem-solving skills.Leadership and communication skills, and a good team player.Self-motivated with good project management skills.
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